RESUMEN

A novel design of a MEMS (Micro-Electromechanical System) capacitive accelerometer fabricated by surface micromachining, with a structure enabling precise auto-calibration during operation, is presented. Precise auto-calibration was introduced to ensure more accurate acceleration measurements compared to standard designs. The standard mechanical structure of the accelerometer (seismic mass integrated with elastic suspension and movable plates coupled with fixed plates forming a system of differential sensing capacitors) was equipped with three movable detection electrodes coupled with three fixed electrodes, thus creating three atypical tunneling displacement transducers detecting three specific positions of seismic mass with high precision, enabling the auto-calibration of the accelerometer while it was being operated. Auto-calibration is carried out by recording the accelerometer indication while the seismic mass occupies a specific position, which corresponds to a known value of acting acceleration determined in a pre-calibration process. The diagram and the design of the mechanical structure of the accelerometer, the block diagram of the electronic circuits, and the mathematical relationships used for auto-calibration are presented. The results of the simulation studies related to mechanical and electric phenomena are discussed.

RESUMEN

Metasurface coatings on a free-standing SiN thin film membrane are fabricated on a Si substrate using masked lithography and CMOS-compatible surface micromachining. The result is a band-limited absorber for the mid-IR, which is part of a microstructure that is attached to the substrate by long and slender suspension beams to provide thermal isolation. As a residual of the fabrication, the regular pattern of sub-wavelength unit cells of 2.6 µm side length, which defines the metasurface, is interrupted by an equally regular array of sub-wavelength holes of 1-2 µm diameter and at 7.8-15.6 µm of pitch. This array of holes is essential for enabling access of the etchant and attack of the underlying layer during fabrication, which ultimately results in the sacrificial release of the membrane from the underlying substrate. As the plasmonic responses of the two patterns interfere, a maximum is imposed on the hole diameter and a minimum on the hole-to-hole pitch. However, the hole diameter should be sufficiently large to allow access of the etchant, while the maximum spacing between holes is set by the limited selectivity of the different materials to the etchant during sacrificial release. The effect of the parasitic hole pattern on the spectral absorption of a metasurface design is analyzed by simulations of the responses of combined holes-metasurface structures. Arrays of 300 × 180 µm2 Al-Al2O3-Al MIM structures are mask-fabricated on suspended SiN beams. The results show that the effect of the array of holes can be disregarded for a hole-to-hole pitch larger than 6 times the side length of the metamaterial until cell, while the diameter of the hole should remain smaller than about 1.5 µm, and their alignment is critical.

RESUMEN

Many brittle materials, such as single-crystal materials, amorphous materials, and ceramics, are widely used in many industries such as the energy industry, aerospace industry, and biomedical industry. In recent years, there is an increasing demand for high-precision micro-machining of these brittle materials to produce precision functional parts. Traditional ultra-precision micro-machining can lead to workpiece cracking, low machined surface quality, and reduced tool life. To reduce and further solve these problems, a new micro-machining process is needed. As one of the nontraditional machining processes, rotary ultrasonic machining is an effective method to reduce the issues generated by traditional machining processes of brittle materials. Therefore, rotary ultrasonic micro-machining (RUµM) is investigated to conduct the surface micro-machining of brittle materials. Due to the small diameter cutting tool (<500 µm) and high accuracy requirements, the impact of input parameters in the rotary ultrasonic surface micro-machining (RUSµM) process on tool deformation and cutting quality is extremely different from that in rotary ultrasonic surface machining (RUSM) with relatively large diameter cutting tool (∼10 mm). Up till now, there is still no investigation on the effects of ultrasonic vibration (UV) and input variables (such as tool rotation speed and depth of cut) on cutting force and machined surface quality in RUSµM of brittle materials. To fill this knowledge gap, rotary ultrasonic surface micro-machining of the silicon wafer (one of the most versatile brittle materials) was conducted in this study. The effects of ultrasonic vibration, tool rotation speed, and depth of cut on tool trajectory, material removal rate (MRR), cutting force, cutting surface quality, and residual stress were investigated. Results show that the ultrasonic vibration could reduce the cutting force, improve the cutting surface quality, and suppress the residual compressive stress, especially under conditions with high tool rotation speed.

Asunto(s)

Silicio , Ultrasonido , Cerámica , Industrias/métodos , Fenómenos Mecánicos

RESUMEN

Capacitive micromachined ultrasonic transducers (CMUTs) represent an accepted technology for ultrasonic transducers, while high bias voltage requirements and limited output pressure still need to be addressed. In this paper, we present a design for ultra-low-voltage operation with enhanced output pressure. Low voltages allow for good integrability and mobile applications, whereas higher output pressures improve the penetration depth and signal-to-noise ratio. The CMUT introduced has an ultra-thin gap (120 nm), small plate thickness (800 nm), and is supported by a non-flexural piston, stiffening the topside for improved average displacement, and thus higher output pressure. Three designs for low MHz operation are simulated and fabricated for comparison: bare plate, plate with small piston (34% plate coverage), and big piston (57%). The impact of the piston on the plate mechanics in terms of resonance and pull-in voltage are simulated with finite element method (FEM). Simulations are in good agreement with laser Doppler vibrometer and LCR-meter measurements. Further, the sound pressure output is characterized in immersion with a hydrophone. Pull-in voltages range from only 7.4 V to 25.0 V. Measurements in immersion with a pulse at 80% of the pull-in voltage present surface output pressures from 44.7 kPa to 502.1 kPa at 3.3 MHz to 4.2 MHz with a fractional bandwidth of up to 135%. This leads to an improvement in transmit sensitivity in pulsed (non-harmonic) driving from 7.8 kPa/V up to 24.8 kPa/V.

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One of the most commonly applied methods of joining dissimilar materials is gluing. This could be mainly attributed to the applicability of this technique in various industries. The article presents a method of material surface treatment, which increases the shear strength of adhesive joints for lightweight metals such as aluminum with plastics. For this purpose, laser surface microstructuring was performed on each of the selected construction materials. As a result of the performed treatment, the active surface of the glued area was increased, which increased the adhesive strength. The picosecond laser with UV radiation used in the research is TruMicro 5325c with which material can be removed as a result of the cold ablation phenomenon. The applied parameters of the laser device did not cause thermal damage to the surface of the microstructured materials, which was confirmed by microscopic examination. Laser micromachining did not deteriorate the degree of wetting of the tested materials, either, as was confirmed by the contact angle and surface energy measurements with the use of water as the measuring liquid. In investigated cases of microstructure types, the presented method significantly increased the shear strength of the joints formed, as demonstrated by the presented strength test results. Research has shown that created joints with microstructure made according to the described method, are characterized by a significant increase in strength, up to 376%, compared to materials without microstructure. The presented results are part of a series of tests aimed at selecting the operating laser parameters for the implementation of geometric shapes of microstructures which will increase the strength of adhesive joints in selected materials.

RESUMEN

This paper presents modeling and analysis of light diffraction and light-intensity modulation performed by an optical phased array (OPA) system based on metal-coated silicon micromirrors. The models can be used in the design process of a microelectromechanical system (MEMS)-based OPA device to predict its optical performance in terms of its field of view, response, angular resolution, and long-range transmission. Numerical results are derived using an extended model for the 1st-order diffracted light intensity modulation due to phase shift. The estimations of the optical characteristics are utilized in the designs of an OPA system capable of active phase modulation and an OPA system capable of array pitch tuning. Both designs are realized using the Multi-User MEMS Processes (PolyMUMPs) in which polysilicon is used as structural material for the MEMS-actuated mirrors. The experiments are performed to evaluate the optical performance of the prototypes. The tests show that the individually actuated micromirrors, which act as phase shifters, can transmit the most optical power along the 1st-order diffracted beam by actively changing their out-of-plane positions. In addition, the 1st-order diffracted beam with high optical intensity can be steered for distance measurement.

RESUMEN

An omnidirectional inertial switch with rectangular spring is proposed in this paper, and the prototype has been fabricated by surface micromachining technology. To evaluate the threshold consistency and stability of omnidirectional inertia switch, the stiffness of rectangular suspension springs is analyzed. The simulation result shows that the coupling stiffness of the rectangular spring suspension system in the non-sensitive direction is a little more than that in the sensitive direction, which indicated that the omnidirectional switching system's stability is reinforced, attributed to the design of rectangular springs. The dynamic response simulation shows that the threshold of the omnidirectional inertial switch using the rectangular suspension spring has high consistency in the horizontal direction. The prototype of an inertial switch is fabricated and tested successfully. The testing results indicate even threshold distribution in the horizontal direction. The threshold acceleration of the designed inertial switch is about 58 g in the X direction and 37 g in the Z direction; the contact time is about 18 µs.

RESUMEN

Micro-electromechanical system (MEMS) micromirrors have been in development for many years, but the ability to steer beams to angles larger than 20° remains a challenging endeavor. This paper details a MEMS micromirror device capable of achieving large motion for both tip/tilt angles and piston motion. The device consists of an electrothermal actuation assembly fabricated from a carefully patterned multilayer thin-film stack (SiO2/Al/SiO2) that is epoxy bonded to a 1 mm2 Au coated micromirror fabricated from an SOI wafer. The actuation assembly consists of four identical actuators, each comprised of a series of beams that use the inherent residual stresses and coefficient of thermal expansion (CTE) mismatches of the selected thin films to enable the large, upward, out-of-plane deflections necessary for large-angle beamsteering. Finite element simulations were performed (COMSOL v5.5) to capture initial elevations and tip/tilt motion displacements and achieved <10% variance in comparison to the experiment. The measured performance metrics of the micromirror include tip/tilt angles of ±23°, piston motion of 127 µm at sub-resonance, and dynamics characterization with observed resonant frequencies at ~145 Hz and ~226 Hz, for tip/tilt and piston motion, respectively. This unique single element design can readily be scaled into a full segmented micromirror array exhibiting an optical fill-factor >85%, making it suitable for optical phased array beam control applications.

RESUMEN

 The application of a carbon nanowall (CNW) via transfer is very demanding due to the unusual structure of vertically grown wall-shaped that easily collapses. In addition, direct growth on a device cannot obtain a precision-patterned shape because of the temperature limit of the photoresist (PR). Therefore, in this paper, we demonstrate a new CNW surface micromachining technology capable of direct growth. In order to reduce unexpected damage caused by chemical etching, a physical force was used to etch with the adhesive properties of CNWs that have low adhesion to silicon wafer. To prevent compositing with PR, the CNW was surface modified using oxygen plasma. Since there is a risk of surface-modified CNW (SMCNW) collapse in an ultrasonic treatment, which is a physical force, the CNW was coated with PR. After etching the SMCNW grown on PR uncoated area, PR was lifted off using an acetone solution. The effect on the SMCNW by the lift-off process was investigated. The surface, chemical, and structural properties of PR-removed SMCNW and pristine-SMCNW were compared and showed a minimal difference. Therefore, the CNW surface micromachining technique was considered successful.

RESUMEN

In this work, to evaluate the influence of the threshold on the dynamic contact process, five models (number 1, 2, 3, 4, 5) with different thresholds were proposed and fabricated with surface micromachining technology. The contact time and response time were used to characterize the dynamic contact performance. The dynamic contact processes of the inertial switches with gradually increasing thresholds were researched using analytical, simulation, and experimental methods. The basic working principle analysis of the inertial switch shows that the contact time of the inertial switch with a low-g value can be extended by using a simply supported beam as the fixed electrode, but the high-G inertial needs more elasticity for fixed electrode. The simulation results indicate that the response time and contact time decrease with the increment in the designed threshold. Prototypes were tested using a dropping hammer system, and the test result indicates that the contact time of the inertial switch with a fixed electrode of the simply supported beam is about 15 and 5 µs when the threshold is about 280 and 580 g, respectively. Meanwhile, the contact time can be extended to 100 µs for the inertial switch using a spring as the fixed electrode when the threshold is about 280 and 580 g. These test results not only prove that the spring fixed electrode can effectively extend the contact time, but also prove that the style of the fixed electrode is the deciding factor affecting the contact time of the high-G inertial switch.

RESUMEN

A mechanical trigger inertial micro-switch with spring stationary electrode is proposed and fabricated by surface micromachining. The elastic contact process and stability performance are evaluated through experimental tests performed using a drop hammer. The test results show that the contact time is about 110 µs and 100 µs when the threshold acceleration is 480 g and the overload acceleration is 602 g, respectively. The vibration process of the electrodes is explained through an established physical mode. The elastic contact process is analyzed and discussed by Finite Element Analysis (FEA) simulations, which indicated that the contact time is about 65 µs when the threshold acceleration is 600 g. At the same time, this result also proved that the contact time could be extended effectively by the designed spring stationary electrode. The overload acceleration (800 g) has been applied to the Finite-Element model in ANSYS, the contact process indicated that the proof mass contacted with stationary electrode three times, and there was no bounce phenomenon during contact process, which fully proved that the stable contact process can be realized at high acceleration owing to the designed elastic stationary electrode.

RESUMEN

The design and fabrication of a Micro-electromechanical Systems (MEMS)-based tilted microcoil on a polyimide capillary are reported in this paper, proposed for an electromagnetically-driven single-fiber endoscope scanner application. The parameters of the tilted microcoil were optimized by simulation. It is proved that the largest driving force could be achieved when the tilt-angle, the pitch and the coil turns of the designed microcoil were 60°, 80 µm and 20, respectively. The modal simulation of the designed fiber scanner was carried out. The prototypes of the tilted microcoils were fabricated on the surface of polyimide capillary with 1 mm-diameter using our developed cylindrical projection lithography system. The dimensions of the two tilted microcoils were as follows: one was tilt-angle 45°, line width 10 ± 0.2 µm, coil pitch 78.5 ± 0.5 µm, and the other was tilt-angle 60°, line width 10 ± 0.2 µm, coil pitch 81.5 ± 0.5 µm. Finally, a direct mask-less electroplating process was employed to fabricate the copper microcoil with 15 µm thickness on the gold (Au) seed-layer, and the corresponding line width was expanded to 40 µm.

RESUMEN

This letter proposes a method for utilizing a positive photoresist, Shipley 1805, as a sacrificial layer for sub-180 °C fabrication process flows. In the proposed process, the sacrificial layer is etched at the end to release the structures using a relatively fast wet-etching technique employing resist remover and a critical point dryer (CPD). This technique allows high etching selectivity over a large number of materials, including silicon-based structural materials such as silicon-carbide, metals such as titanium and aluminum, and cured polymers. This selectivity, as well as the low processing thermal budget, introduces more flexibility in material selection for monolithic integration above complementary metal oxide semiconductor (CMOS) as well as flexible substrates.

RESUMEN

This article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress development when subjected to excessive thermal loads. A selective etch process is reported which enables the copper seed layer used for electrodeposition to be removed while preserving the integrity of Ni-Fe. In addition, a low temperature deposition and surface micromachining process is presented in which silicon dioxide and silicon nitride are used, respectively, as sacrificial material and structural dielectric. The sacrificial layer can be patterned and removed by wet buffered oxide etch or vapour HF etching. The reported methods limit the thermal budget and minimise the stress development in Ni-Fe. This combination of techniques represents an advance towards the reliable integration of Ni-Fe components in complex surface micromachined magnetic MEMS.

RESUMEN

A novel micro-electro-mechanical systems (MEMS) inertial microswitch with a flexible contact-enhanced structure to extend the contact duration has been proposed in the present work. In order to investigate the stiffness k of the stationary electrodes, the stationary electrodes with different shapes, thickness h, width b, and length l were designed, analyzed, and simulated using ANSYS software. Both the analytical and the simulated results indicate that the stiffness k increases with thickness h and width b, while decreasing with an increase of length l, and it is related to the shape. The inertial micro-switches with different kinds of stationary electrodes were simulated using ANSYS software and fabricated using surface micromachining technology. The dynamic simulation indicates that the contact time will decrease with the increase of thickness h and width b, but increase with the length l, and it is related to the shape. As a result, the contact time decreases with the stiffness k of the stationary electrode. Furthermore, the simulated results reveal that the stiffness k changes more rapidly with h and l compared to b. However, overlarge dimension of the whole microswitch is contradicted with small footprint area expectation in the structure design. Therefore, it is unreasonable to extend the contact duration by increasing the length l excessively. Thus, the best and most convenient way to prolong the contact time is to reduce the thickness h of the stationary electrode while keeping the plane geometric structure of the inertial micro-switch unchanged. Finally, the fabricated micro-switches with different shapes of stationary electrodes have been evaluated by a standard dropping hammer system. The test maximum contact time under 288 g acceleration can reach 125 µs. It is shown that the test results are in accordance with the simulated results. The conclusions obtained in this work can provide guidance for the future design and fabrication of inertial microswitches.

RESUMEN

This article reports a process for batch fabrication of a fiber pigtailed optomechanical transducer platform with overhanging. The platform enables a new class of high bandwidth, high sensitivity, and highly integrated sensors that are, compact, robust, and small, with the potential potential for low cost batch fabrication inherent in Micro-Opto-Electro-Mechanical-Systems technology. This article provides a guide to the whole fabrication process and explains critical steps and process choices in detail. Possible alternative fabrication techniques and problems are discussed. The fabrication process consists of electron beam lithography, i-line stepper lithography, and back- and frontside mask aligner lithography. The goal of this article is to provide a comprehensive description of the fabrication process, presenting context and details which are highly relevant to the rational implementation and reliable repetition of the process. Moreover, this process makes use of equipment commonly found in nanofabrication facilities and research laboratories, facilitating the broad adaptation and application of the process. Therefore, while this article specifically informs users of the Center for Nanoscale Science and Technology (CNST) at the National Institute of Standards and Technology (NIST), we anticipate that this information will be generally useful for the nano- and microfabrication research communities at large.

RESUMEN

We report on the effect of repetition rate on the formation and surface texture of the laser induced homogenous microstructures. Different microstructures were micromachined on copper (Cu) and titanium (Ti) using femtosecond pulses at 1 and 10 kHz. We studied the effect of the repetition rate on structure formation by comparing the threshold accumulated pulse ( F Σ p u l s e ) values and the effect on the surface texture through lacunarity analysis. Machining both metals at low F Σ p u l s e resulted in microstructures with higher lacunarity at 10 kHz compared to 1 kHz. On increasing F Σ p u l s e , the microstructures showed higher lacunarity at 1 kHz. The effect of the repetition rate on the threshold F Σ p u l s e values were, however, considerably different on the two metals. With an increase in repetition rate, we observed a decrease in the threshold F Σ p u l s e on Cu, while on Ti we observed an increase. These differences were successfully allied to the respective material characteristics and the resulting melt dynamics. While machining Ti at 10 kHz, the melt layer induced by one laser pulse persists until the next pulse arrives, acting as a dielectric for the subsequent pulse, thereby increasing F Σ p u l s e . However, on Cu, the melt layer quickly resolidifies and no such dielectric like phase is observed. Our study contributes to the current knowledge on the effect of the repetition rate as an irradiation parameter.