Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes.

Schiavone, Giuseppe; Murray, Jeremy; Perry, Richard; Mount, Andrew R; Desmulliez, Marc P Y; Walton, Anthony J

Schiavone, Giuseppe; Murray, Jeremy; Perry, Richard; Mount, Andrew R; Desmulliez, Marc P Y; Walton, Anthony J.

Afiliación

Schiavone G; SMC, School of Engineering, University of Edinburgh, Edinburgh EH9 3FF, UK. giu.schiavone@gmail.com.
Murray J; SMC, School of Engineering, University of Edinburgh, Edinburgh EH9 3FF, UK. jeremy.murray@pyreos.com.
Perry R; School of Chemistry, University of Edinburgh, Edinburgh EH9 3FF, UK. jeremy.murray@pyreos.com.
Mount AR; School of Chemistry, University of Edinburgh, Edinburgh EH9 3FF, UK. richard.perry@ed.ac.uk.
Desmulliez MPY; School of Chemistry, University of Edinburgh, Edinburgh EH9 3FF, UK. a.mount@ed.ac.uk.
Walton AJ; School of Engineering & Physical Sciences, Heriot-Watt University, Edinburgh EH14 4AS, UK. m.desmulliez@hw.ac.uk.

Materials (Basel) ; 10(3)2017 Mar 22.

Article en En | MEDLINE | ID: mdl-28772683

Palabras clave

MEMS; Ni-Fe electroplating; Ni-Fe integration; Permalloy; magnetic microactuators; selective etching; surface micromachining

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2017 Tipo del documento: Article País de afiliación: Reino Unido Pais de publicación: Suiza

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