RESUMEN

The adhesion problem of the liquid aluminum (Al) and solid surfaces in the production process has not been completely solved. In this paper, by performing the molecular dynamic simulations, we first establish models composed of liquid-Al/Al and liquid-Al/silicon (Si) systems, in which the region of solid temperature is from 100 K to 800 K. Then, the dependence between the adhesion force and the solid temperature is qualitatively investigated. The adhesion mechanism of liquid atoms is explored in terms of their diffusion behavior. The results show that there is an opposite effect of the temperature on adhesion properties between the liquid-Al/Al interface and the liquid-Al/Si interface. The thermal excitation effect induces enlargement of the probability of atomic collisions, which accounts for the increase of the adhesion force at the liquid-Al/Al interface. Conversely, the thermal excitation effect leads to the detachment of the atoms in contact with each other, which reduces the adhesion force at the liquid-Al/Si interface. Our findings reveal that the solid Al surface is aluminophilic but the solid Si surface is aluminophobic. In addition, the adhesion between liquid-Al and solid surfaces can be explained by the variation of the interfacial potential.