Temperature dependence of adhesion properties at liquid-aluminum/solid interfaces.

Wu, Jie; Rui, Zhiyuan; Wang, Zhongyu; Dong, Yun

Wu, Jie; Rui, Zhiyuan; Wang, Zhongyu; Dong, Yun.

Afiliación

Wu J; School of Mechanical and Electrical Engineering, Lanzhou University of Technology, Lanzhou 730050, People's Republic of China.
Rui Z; School of Mechanical and Electrical Engineering, Lanzhou University of Technology, Lanzhou 730050, People's Republic of China.
Wang Z; School of Mechanical and Electrical Engineering, Lanzhou University of Technology, Lanzhou 730050, People's Republic of China.
Dong Y; School of Mechanical and Electrical Engineering, Lanzhou University of Technology, Lanzhou 730050, People's Republic of China.

J Phys Condens Matter ; 35(16)2023 Feb 24.

Article en En | MEDLINE | ID: mdl-36787638

Palabras clave

adhesion force; liquid-aluminum/solid interface; molecular dynamics simulations; solid temperature

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Revista: J Phys Condens Matter Asunto de la revista: BIOFISICA Año: 2023 Tipo del documento: Article Pais de publicación: Reino Unido

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