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The implementation of hard-facing alloy on the existing materials caters the need for high-performance surfaces in terms of wear and high temperatures. The present research explore the effect of Plasma Transferred Arc Welding (PTAW) parameters and powder composition on dilution, microstructure and hardness of the commonly used hard-facing alloy Ni-Cr-Si-B powder. The hard-facing alloy was deposited with three weight proportions of boron (2.5 %, 3 % and 3.5 %). The statistical-based Grey Relational Analysis (GRA) followed by a Machine Learning Algorithm (MLA) was implemented to identify the ideal parameters and degree of significance of each parameter and for the prediction of the responses. The dilution percentage, microstructure analysis, and phase detection were estimated through elemental analysis, Scanning electron Microscopy (SEM) and X-ray Diffraction Analysis (XRD) respectively. The experimental and modelling results revealed that 400 mm/min of scanning speed, 8 gm/min of powder delivery, 14 mm of stand-off distance, and 120 A of current were the optimal parameters along with 3.5 wt% of boron powder composition to yield a better dilution, microstructure and hardness.
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Fine-grain copper (Cu) films (grain size: 100.36 nm) with a near-atomic-scale surface (0.39 nm) were electroplated. Without advanced post-surface treatment, Cu-Cu direct bonding can be achieved with present-day fine-grain Cu films at 130â in air ambient with a minimum pressure of 1 MPa. The instantaneous growth rate on the first day is 164.29 nmâ¯d-1. Also, the average growth rate (∆R/∆t) is evaluated by the present experimental results: (i) 218.185 nmâ¯d-1 for the first-day period and (ii) 105.58 nmâ¯d-1 during the first 14-day period. Ultrafast grain growth and near-atomic-scale surface facilitate grain boundary motion across the bonding interface, which is the key to achieve Cu-Cu direct bonding at 130â in air ambient.
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The orientation and shape of ceramics grains was always neglected, resulting in a lot of information during sintering has not been excavated. In this study, a modified phase-field model in order to express the anisotropy of grain boundary energy is developed. The effects of the anisotropy of grain boundary energy on the grain orientation and shape evolution are investigated in detail. The ferroelectric ceramic thick films are prepared by tape casting. The comparison of experiment and simulation results shows that the anisotropy of grain boundary energy results in uneven grain orientation and bimodal grain size distribution. The quantitative analysis of grain microstructures helps to establish a relationship with the degree of anisotropy of grain boundary energy. Our findings provide a new way to judge the degree of anisotropy by calculating the relevant parameters in the SEM images of ceramics materials.
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Cu-Cu joints have been adopted for ultra-high density of packaging for high-end devices. However, the processing temperature must be kept relatively low, preferably below 300 °C. In this study, a novel surface modification technique, quenching treatment, was applied to achieve Cu-to-Cu direct bonding using (111)-oriented nanotwinned Cu. The quenching treatment enabled grain growth across the Cu-Cu bonding interface at 275 °C. During quenching treatment, strain energy was induced in the Cu film, resulting in a wrinkled surface morphology. To analyze the strain energy, we utilized an electron backscattered diffraction system to obtain crystallographic information and confirmed it using kernel average misorientation analysis.
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Grain growth for various texture components in silicon steel was investigated via experiments and modeling. It was found that the clustered spatial arrangement of grains with specific orientations significantly altered the local environment for grain growth and consequently resulted in texture-differentiated grain size distribution (GSD) evolution. A novel local-field model was proposed to describe grain growth driven by continuous changing orientation and size distribution of adjacent grains. The modelling results show that the texture-differentiated grain growth in microstructure with grain clusters can produce a GSD with increased proportion in small-sized range and large-sized range by more than two-times, accompanied with an evident change in area fractions of various texture components. The effect of clustered spatial arrangement on grain growth can be precisely predicted, which is valuable to design and control the texture-differentiated GSD as well as the global GSD.
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For decades, Moore's Law has been approaching its limits, posing a huge challenge for further downsizing to nanometer dimensions. A promising avenue to replace Moore's Law lies in three-dimensional integrated circuits, where Cu-Cu bonding plays a critical role. However, the atomic diffusion rate is notably low at temperatures below 300 °C, resulting in a distinct weak bonding interface, which leads to reliability issues. In this study, a quenching treatment of the Cu film surface was investigated. During the quenching treatment, strain energy was induced due to the variation in thermal expansion coefficients between the Si substrate and the Cu film, resulting in a wrinkled surface morphology on the Cu film. Grain growth was observed at the Cu-Cu bonding interface following bonding at 300 °C for 2 and 4 h. Remarkably, these procedures effectively eliminated the bonding interface.
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To investigate the interconnected effects of manufacturing processes on microstructure evolution during hot-rolling, a through process model is required. A novel numerical implementation of the mean-field approach was introduced to efficiently describe the grain growth of larger systems and extended durations. In this approach, each grain is embedded within an average medium and interacts with the average medium, thus avoiding the complexities of individual grain interactions. The proposed upsampling approach dynamically adjusts the simulation grain ensemble, ensuring efficiency and accuracy regardless of the initial number of grains present. This adaptation prevents undersampling artifacts during grain growth. The accuracy of the model is verified against analytical solutions and experimental data, demonstrating high agreement. Moreover, the effects of different initial conditions are successfully investigated, demonstrating the model's versatility. Due to its simplicity and efficiency, the model can be seamlessly integrated into other microstructure evolution models.
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During thermal deformation, grain coarsening due to grain growth and grain refinement resulting from dynamic recrystallization (DRX) collectively influence the deformed grain size. To investigate the separative and comprehensive effects of the two mechanisms in the Ni-38Cr-3.8Al alloy, grain growth experiments and isothermal compression tests were conducted. Kinetics models for grain growth and DRX behaviors were established based on the experimental data, which were integrated with finite element (FE) techniques to simulate the evolution of grain size throughout the entire thermal compression process. The effects of grain coarsening and grain refinement during this process were separated and quantified based on the simulation data. The results revealed that grain coarsening predominated during the heating and holding stages, with a longer holding time and higher holding temperatures intensifying this effect. However, during the compression stage, grain coarsening and grain refinement co-existed, and their competition was influenced by deformation parameters. Specifically, grain refinement dominated at strain rates exceeding 0.1 s-1, while grain coarsening dominated at lower strain rates (<0.1 s-1) and higher deformation temperatures (>1373 K). The simulated grain sizes closely matched the experimental observations.
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For decades, Moore's Law has neared its limits, posing significant challenges to further scaling it down. A promising avenue for extending Moore's Law lies in three-dimensional integrated circuits (3D ICs), wherein multiple interconnected device layers are vertically bonded using Cu-Cu bonding. The primary bonding mechanism involves Cu solid diffusion bonding. However, the atomic diffusion rate is notably low at temperatures below 300 °C, maintaining a clear and distinct weak bonding interface, which, in turn, gives rise to reliability issues. In this study, a new method of surface modification using epoxy resin to form fine grains on a nanotwinned Cu film was proposed. When bonded at 250 °C, the interfacial grains grew significantly into both sides of the Cu film. When bonded at 300 °C, the interfacial grains extended extensively, eventually eliminating the original bonding interface.
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Environment-friendly antisolvents are critical for obtaining highly efficient, reproducible, and sustainable perovskite solar cells (PSCs). Here, we introduced a green mixture antisolvent of ethyl acetate-isopropanol (EA/IPA) to finely regulate the crystal grain growth and related film properties, including the morphology, crystal structure, and chemical composition of the perovskite thin film. The IPA with suitable content in EA plays a key role in achieving a smooth and compact high-quality perovskite thin film, leading to the suppression of film defect-induced nonradiative recombination. As a result, the PSCs based on the EA/IPA (5:1) antisolvent showed a power conversion efficiency of 22.9% with an open-circuit voltage of 1.17 V.
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The paper reports on effect of grain-growth inhibitors MgO, Y2O3 and MnCO3 as well as Ca modification on the microstructure, dielectric, ferroelectric and electrocaloric (EC) properties of Ba0.82Sr0.18Sn0.065Ti0.935O3 (BSSnT). Furthermore, the effects of the sintering time and temperature on the microstructure and the electrical properties of the most promising material system Ba0.62Ca0.20Sr0.18Sn0.065Ti0.935O3 (BCSSnT-20) are investigated. Additions of MgO (xMgO = 1%), Y2O3 (xY2O3 = 0.25%) and MnCO3 (xMnCO3 = 1%) significantly decreased the mean grain size of BSSnT to 0.4 µm, 0.8 µm and 0.4 µm, respectively. Ba0.62Ca0.20Sr0.18Sn0.065Ti0.935O3 (BCSSnT-20) gained a homogeneous fine-grained microstructure with an average grain size of 1.5 µm, leading to a maximum electrocaloric temperature change |ΔTEC| of 0.49 K at 40 °C with a broad peak of |ΔTEC| > 0.33 K in the temperature range from 10 °C to 75 °C under an electric field change of 5 V µm-1. By increasing the sintering temperature of BCSSnT-20 from 1350 °C to 1425 °C, the grain size increased from 1.5 µm to 7.3 µm and the maximum electrocaloric temperature change |ΔTEC| increased from 0.15 K at 35 °C to 0.37 K at 20 °C under an electric field change of 2 V µm-1. Our results show that under all investigated material systems, BCSSnT-20 is the most promising candidate for future application in multilayer ceramic (MLC) components for EC cooling devices.
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(K0.5Na0.5)NbO3 (KNN)-based ceramics have been extensively investigated as replacements for Pb(Zr, Ti)O3-based ceramics. KNN-based ceramics exhibit an orthorhombic structure at room temperature and a rhombohedral-orthorhombic (R-O) phase transition temperature (TR-O), orthorhombic-tetragonal (O-T) phase transition temperature (TO-T), and Curie temperature of -110, 190, and 420 °C, respectively. Forming KNN-based ceramics with a multistructure that can assist in domain rotation is one technique for enhancing their piezoelectric properties. This review investigates and introduces KNN-based ceramics with various multistructures. A reactive-templated grain growth method that aligns the grains of piezoceramics in a specific orientation is another approach for improving the piezoelectric properties of KNN-modified ceramics. The piezoelectric properties of the [001]-textured KNN-based ceramics are improved because their microstructures are similar to those of the [001]-oriented single crystals. The improvement in the piezoelectric properties after [001] texturing is largely influenced by the crystal structure of the textured ceramics. In this review, [001]-textured KNN-based ceramics with different crystal structures are investigated and systematically summarized.
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Mn-substituted Cu and Zn co-doped spinel-typed nano-crystalline ferrites having nominal composition Ni0.50-xMnxCu0.15Zn0·35Fe2O4 (x = 0.00-0.25 in 0.05 increments) have been prepared through the citric acid assisted sol-gel auto-combustion technique. From the XRD measurements, it was found that several intense peaks ensured the cubic spinel-based ferrite structure beyond the formation of any impurity peaks. The crystallite sizes varied from 20 to 28 nm for ash-burnt powders following the coalescence process that decreased the lattice defects and strain. With an increase in Mn concentration, the hopping length (LA) of the tetrahedral A-site increases, while the hopping length (LB) of the octahedral B-site decreases with enhanced lattice constant. The sintered samples' average grain sizes, as measured using the Field Emission Scanning Micrographs (FESEM), differed from around 1.40 to 5.30 µm. Incorporating Mn-ion accelerates grain growth and crystallite size with increased bulk density and reduced porosity due to heat treatment. For increasing sintering temperature along with Mn concentration, porosity drops from 42% to 3%, resulting in enhancing the magnetic induction of the prepared ferrites. The 25% Mn substituted composition displays the maximum initial permeability (µi' = 315), which is â¼7 times larger than the pristine composition. Due to the reduction of Ni content, the relative quality factor rises but the magnetic loss tangent reduces. An increased trends of µi' are accompanied by decreased resonant frequency, obeying Snoek's law. According to the experimental findings, the high spin Mn substitution in the composition causes the saturation magnetization to increase while the coercivity and Néel temperature drop with increasing grain size. Hence, the locally prepared low-cost Nano-crystalline Ni-Mn-Cu-Zn ferrites bearing excellent properties can be a good candidate for promising future applications in nanotechnology.
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Single crystallization of LiNix Coy Mn1-x-y O2 (NCM) is currently an effective strategy to improve the cycling life of NCM cathode, owing to the reduced surface area and enhanced mechanical strength, but the application of single crystal NCM(SC-NCM) is being hindered by severe particle agglomeration and poor C-rate performance. Here, a strategy of three-section-sintering(TSS) with the presence of grain-growth inhibitor was proposed, in which, the TSS includes three sections of phase-formation, grain-growth and phase-preservation. While, the addition of MoO3 inhibits the grain growth and restrains the particle agglomeration. With the help of TSS and 1â mol % of MoO3 , highly dispersed surface Mo-doped SC-NCM(MSC-NCM) cubes are obtained with the average diameter of 1.3â µm. Benefiting from the surface Mo-doping and the reduced surface energy, the Li+ -migration preferred (1 0 4) crystalline facet is exposed as the dominant plane in MSC-NCM cubes, because of which, C-rate performance is significantly improved compared with the regular SC-NCM. Furthermore, this preparation strategy is compatible well with the current industrial production line, providing an easy way for the large-scale production of SC-NCM.
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Grain rotation is commonly observed during the evolution of microstructures in polycrystalline materials of different kinds, including metals, ceramics, and colloidal crystals. It is widely accepted that interface migration in these systems is mediated by the motion of line defects with step and dislocation character, i.e., disconnections. We propose a crystallography-respecting continuum model for arbitrarily curved grain boundaries or heterophase interfaces, accounting for the disconnections' role in grain rotation. Numerical simulations demonstrate that changes in grain orientations, as well as interface morphology and internal stress field, are associated with disconnection flow. Our predictions agree with molecular dynamics simulation results for pure capillarity-driven evolution of grain boundaries and are interpreted through an extended Cahn-Taylor model.
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Dual-phase (DP) steel has been widely used in automotive steel plates with a balance of excellent strength and ductility. Grain refinement in DP steel is important to improve the properties further; however, the factors affecting grain growth need to be well understood. The remaining problem is that acquiring data through experiments is still time-consuming and difficult to evaluate quantitatively. With the development of materials informatics in recent years, material development time and costs are expected to be significantly reduced through experimentation, simulation, and machine learning. In this study, grain growth behavior in DP steel was studied using two-dimensional (2D) and three-dimensional (3D) Monte Carlo modeling and simulation to estimate the effect of some key parameters. Grain growth can be suppressed when the grain boundary energy is greater than the phase boundary energy. When the volume fractions of the matrix and the second phase were equal, the suppression of grain growth became obvious. The long-distance diffuse frequency can promote grain growth significantly. The simulation results allow us to better understand the factors affecting grain growth behavior in DP steel. Machine learning was performed to conduct a sensitivity analysis of the affecting parameters and estimate the magnitude of each parameter's effects on grain growth in the model. Combining MC simulation and machine learning will provide one promising research strategy to gain deeper insights into grain growth behaviors in metallic materials and accelerate the research process.
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Mean-field models have the ability to predict the evolution of grain size distribution that occurs through thermomechanical solicitations. This article focuses on a comparison of mean-field models under grain-growth conditions. Different microstructure representations are considered and discussed, especially regarding the consideration of topology in the neighborhood construction. Experimental data obtained with a heat treatment campaign on 316L austenitic stainless steel are used for the identification of material parameters and as a reference for model comparisons. Mean-field models are also applied to both mono- and bimodal initial grain size distributions to investigate the potential benefits of introducing neighborhood topology in microstructure prediction models. This article demonstrates that improvements in the predictions can be obtained in monomodal cases for topological models. In the bimodal test, no comparison with experimental data was performed as no data were available. But relative comparisons between models indicated few differences in the predictions. Although of interest, the consideration of neighborhood topology in grain-growth mean-field models generally results in only small improvements compared to classical mean-field models, especially in terms of implementation complexity.
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An investigation of austenite grain growth (AGG) during the isothermal heat treatment of low-alloy steel is conducted. The goal is to uncover the effect of time, temperature, and initial grain size on SA508-III steel grain growth. Understanding this relationship enables the optimization of the time and temperature of the heat treatment to achieve the desired grain size in the studied steel. A modified Arrhenius model is used to model austenite grain size (AGS) growth distributions. With this model, it is possible to predict how grain size will change depending on heat treatment conditions. Then, the generalized reduced gradient (GRG) optimization method is employed under adiabatic conditions to characterize the model's parameters, providing a more precise solution than traditional methods. With optimal model parameters, predicted AGS agree well with measured values. The model shows that AGS increases faster as temperature and time increase. Similarly, grain size grows directly in proportion to the initial grain size. The optimized parameters are then applied to a practical case study with a similar specimen size and material properties, demonstrating that our approach can efficiently and accurately predict AGS growth via GRG optimization.
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A new grain growth model was developed by introducing the ultimate grain size to the traditional model. The grain growth behavior and its ultimate size under the Zenner pinning force are also discussed. This model was applied to the nickel-based superalloy and integrated into an FEM code. The grain evolution of a forged third-generation powder superalloy heat treated at different temperatures and holding times was studied. A gradient heat treatment setup was designed and implemented for a full-size turbine disc based on the model prediction to meet the accurate dual-microstructure requirements of an advanced aero-engine turbine disc design. The predicted temperature was validated by thermal couple measurements. The relative error between the prediction and the measurements is less than 2%. The metallographic examination of the whole turbine disk through sectioning showed that the grain size was ASTM 7-8 at the rim area and ASTM 11-12 at the bore region, which agrees well with the prediction. The predicted values of the three measurement areas are ASTM 12.1, ASTM 9.1, and ASTM 7.1, respectively, with a maximum error of 5% compared to the measured values. The proposed model was validated and successfully applied to help manufacture a dual-microstructure aero-engine turbine disc.
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The behavior of recrystallization and grain growth was examined in Cu-Cu joints during electromigration at 150 °C. Recrystallization and grain growth were observed in all the joints after electromigration for 9000 h. Voiding was formed in Cu current-feeding lines and in bonding interfaces, and resistance increased with time due to the void formation. However, instead of rising abruptly, the resistance of certain Cu joints dropped after 7000 h. Microstructural analysis revealed that a large grain growth occurred in these joints at 150 °C, and the bonding interface was eliminated. Therefore, the electromigration lifetime can be prolonged for these joints.