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Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth.
Lee, Yun-Fong; Huang, Yu-Chen; Chang, Jui-Sheng; Cheng, Ting-Yi; Chen, Po-Yu; Huang, Wei-Chieh; Lo, Mei-Hsin; Fu, Kuan-Lin; Lai, Tse-Lin; Chang, Po-Kai; Yu, Zhong-Yen; Liu, Cheng-Yi.
Afiliación
  • Lee YF; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Huang YC; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Chang JS; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Cheng TY; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Chen PY; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Huang WC; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Lo MH; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Fu KL; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Lai TL; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Chang PK; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Yu ZY; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
  • Liu CY; Department of Chemical and Materials Engineering, National Central University, No. 300, Zhongda Road, Zhongli District, Taoyuan 32001, Taiwan.
R Soc Open Sci ; 11(9): 240459, 2024 Sep.
Article en En | MEDLINE | ID: mdl-39263455
ABSTRACT
Fine-grain copper (Cu) films (grain size 100.36 nm) with a near-atomic-scale surface (0.39 nm) were electroplated. Without advanced post-surface treatment, Cu-Cu direct bonding can be achieved with present-day fine-grain Cu films at 130℃ in air ambient with a minimum pressure of 1 MPa. The instantaneous growth rate on the first day is 164.29 nm d-1. Also, the average growth rate (∆R/∆t) is evaluated by the present experimental

results:

(i) 218.185 nm d-1 for the first-day period and (ii) 105.58 nm d-1 during the first 14-day period. Ultrafast grain growth and near-atomic-scale surface facilitate grain boundary motion across the bonding interface, which is the key to achieve Cu-Cu direct bonding at 130℃ in air ambient.
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: R Soc Open Sci Año: 2024 Tipo del documento: Article País de afiliación: Taiwán Pais de publicación: Reino Unido
Texto completo
Añadir a Mi BVS
Imprimir
XML
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: R Soc Open Sci Año: 2024 Tipo del documento: Article País de afiliación: Taiwán Pais de publicación: Reino Unido