Nickel nanoparticle decorated silicon carbide as a thermal filler in thermal conductive aramid nanofiber-based composite films for heat dissipation applications.

Wang, Xin; Dong, Huarui; Ma, Qingyi; Chen, Yanjie; Zhao, Xueling; Chen, Lifei

Wang, Xin; Dong, Huarui; Ma, Qingyi; Chen, Yanjie; Zhao, Xueling; Chen, Lifei.

Afiliação

Wang X; School of Energy and Materials, Shanghai Key Laboratory of Engineering Materials Application and Evaluation, Shanghai Polytechnic University Shanghai 201209 China lfchen@sspu.edu.cn.
Dong H; Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials Shanghai 201209 China.
Ma Q; School of Energy and Materials, Shanghai Key Laboratory of Engineering Materials Application and Evaluation, Shanghai Polytechnic University Shanghai 201209 China lfchen@sspu.edu.cn.
Chen Y; Shanghai Thermophysical Properties Big Data Professional Technical Service Platform, Shanghai Engineering Research Center of Advanced Thermal Functional Materials Shanghai 201209 China.
Zhao X; School of Energy and Materials, Shanghai Key Laboratory of Engineering Materials Application and Evaluation, Shanghai Polytechnic University Shanghai 201209 China lfchen@sspu.edu.cn.
Chen L; School of Resources and Environmental Engineering, Shanghai Polytechnic University Shanghai 201209 P. R. China.

RSC Adv ; 13(30): 20984-20993, 2023 Jul 07.

Article em En | MEDLINE | ID: mdl-37448645

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: RSC Adv Ano de publicação: 2023 Tipo de documento: Article País de publicação: Reino Unido

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