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Universal assembly of liquid metal particles in polymers enables elastic printed circuit board.
Lee, Wonbeom; Kim, Hyunjun; Kang, Inho; Park, Hongjun; Jung, Jiyoung; Lee, Haeseung; Park, Hyunchang; Park, Ji Su; Yuk, Jong Min; Ryu, Seunghwa; Jeong, Jae-Woong; Kang, Jiheong.
Afiliação
  • Lee W; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Kim H; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Kang I; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Park H; Center for Nanomaterials and Chemical Reactions, Institute for Basic Science (IBS), Daejeon 34141, Republic of Korea.
  • Jung J; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Lee H; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Park H; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Park JS; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Yuk JM; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Ryu S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Jeong JW; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Kang J; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
Science ; 378(6620): 637-641, 2022 Nov 11.
Article em En | MEDLINE | ID: mdl-36356149

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Science Ano de publicação: 2022 Tipo de documento: Article País de publicação: Estados Unidos

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Science Ano de publicação: 2022 Tipo de documento: Article País de publicação: Estados Unidos