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Toward the Industrial Application of Aluminum-Based Nanocomposite Material: A Study of Zn-Plating Process in Circuit Breaker Application.
Segura-Cárdenas, Emmanuel; Ulloa-Castillo, Nicolás A; Hernández-Maya, Roberto; Martínez-Romero, Oscar; Elías-Zúñiga, Alex.
Afiliação
  • Segura-Cárdenas E; School of Engineering and Sciences, Tecnologico de Monterrey, Av. Eugenio Garza Sada Sur 2501, Monterrey 64849, Nuevo León, Mexico.
  • Ulloa-Castillo NA; Center for Innovation in Design and Technology, Department of Mechanical Engineering and Advanced Materials, School of Engineering and Sciences, Tecnologico de Monterrey, Av. Eugenio Garza Sada Sur 2501, Monterrey 64849, Nuevo León, Mexico.
  • Hernández-Maya R; Siemens, Research and Development Department, Libramiento Arco Vial Poniente Km 4.2, Santa Catarina 66350, Nuevo León, Mexico.
  • Martínez-Romero O; Department of Mechanical Engineering and Advanced Materials, Institute of Advanced Materials for Sustainable Manufacturing, Tecnologico de Monterrey, Av. Eugenio Garza Sada Sur 2501, Monterrey 64849, Nuevo León, Mexico.
  • Elías-Zúñiga A; Department of Mechanical Engineering and Advanced Materials, Institute of Advanced Materials for Sustainable Manufacturing, Tecnologico de Monterrey, Av. Eugenio Garza Sada Sur 2501, Monterrey 64849, Nuevo León, Mexico.
Nanomaterials (Basel) ; 12(19)2022 Oct 10.
Article em En | MEDLINE | ID: mdl-36234663
This article explores the industrial application of an Al-based nanocomposite reinforced with 0.5 wt.% of multiwalled carbon nanotubes with a Zn mechanical plating applied to fulfill the field requirements of electrical devices. The performance of electric devices made from this nanocomposite material and with a Zn plating was compared with that of MCCB devices using a normal Cu compound. MCCB devices with the Al-based nanocomposites compound showed a better performance, with less heat generated due to a flow of electrical charge passing through the device. The presence of MWCNTs in the Al nanocomposite dissipates heat, maintaining a stable electrical resistance in the MCCB, in contrast to what happens with Cu compound, which increases its electrical resistance as the temperature in the device increases.
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Ano de publicação: 2022 Tipo de documento: Article País de afiliação: México País de publicação: Suíça

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Ano de publicação: 2022 Tipo de documento: Article País de afiliação: México País de publicação: Suíça