Shear bond strength between gold alloy and orthodontic metal bracket using light emitting diode curing light / 대한치과교정학회지
Korean Journal of Orthodontics
; : 27-33, 2010.
Article
en Ko
| WPRIM
| ID: wpr-653917
Biblioteca responsable:
WPRO
ABSTRACT
OBJECTIVE: The need to bond orthodontic brackets onto various alloys has increased because of the increasing demand for adult orthodontic treatment. This study tried to evaluate the shear bond strength between gold alloy and metal bracket using light emitting diode (LED) light curing after metal primer and silicoating surface conditioning. METHODS: Half of the type III gold alloy plates were treated with sandblasting with aluminum oxide and metal primer containing 4-META, the other half were treated with silica and silane. Metal brackets were bonded with Transbond XT light curing adhesive on these plates and shear bond strength were evaluated 1 hour, 6 hours, and 24 hours later. The differences of shear bond strength between groups were evaluated with two-way ANOVA. RESULTS: The results showed higher bond strength in the silicoating group and a tendency of bond strength increase over time. CONCLUSIONS: When using LED curing lights for metal bracket bonding to alloy surfaces, long curing time and silicoating can produce a reliable bonding strength.
Palabras clave
Texto completo:
1
Base de datos:
WPRIM
Asunto principal:
Adhesivos
/
Soportes Ortodóncicos
/
Técnica de Inmunoensayo de Enzimas Multiplicadas
/
Dióxido de Silicio
/
Cementos de Resina
/
Aleaciones
/
Óxido de Aluminio
/
Luz
/
Metacrilatos
Límite:
Adult
/
Humans
Idioma:
Ko
Revista:
Korean Journal of Orthodontics
Año:
2010
Tipo del documento:
Article