A Multi-Sensing IoT System for MiC Module Monitoring during Logistics and Operation Phases.
Sensors (Basel)
; 24(15)2024 Jul 28.
Article
en En
| MEDLINE
| ID: mdl-39123947
ABSTRACT
Modular integrated construction (MiC) is now widely adopted by industry and governments. However, its fragile and delicate logistics are still a concern for impeding project performance. MiC logistic operations involve rigorous multimode transportation, loading-unloading, and stacking during storage. Such processes may induce latent and intrinsic damage to the module. This damage causes safety hazards during assembly and deteriorates the module's structural health during the building use phase. Also, additional inspection and repairs before assembly cause uncertainties and can delay the whole supply chain. Therefore, continuous monitoring of the module's structural response during MiC logistics and the building use phase is vital. An IoT-based multi-sensing system is developed, integrating an accelerometer, gyroscope, and strain sensors to measure the module's structural response. The compact, portable, wireless sensing devices are designed to be easily installed on modules during the logistics and building use phases. The system is tested and calibrated to ensure its accuracy and efficiency. Then, a detailed field experiment is demonstrated to assess the damage, safety, and structural health during MiC logistic operations. The demonstrated damage assessment methods highlight the application for decision-makers to identify the module's structural condition before it arrives on site and proactively avoid any supply chain disruption. The developed sensing system is directly helpful for the industry in monitoring MiC logistics and module structural health during the use phase. The system enables the researchers to investigate and improve logistic strategies and module design by accessing detailed insights into the dynamics of MiC logistic operations.
Texto completo:
1
Colección:
01-internacional
Base de datos:
MEDLINE
Idioma:
En
Revista:
Sensors (Basel)
Año:
2024
Tipo del documento:
Article
País de afiliación:
Hong Kong
Pais de publicación:
Suiza