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Ultraflexible Wireless Imager Integrated with Organic Circuits for Broadband Infrared Thermal Analysis.
Kawabata, Rei; Li, Kou; Araki, Teppei; Akiyama, Mihoko; Sugimachi, Kaho; Matsuoka, Nozomi; Takahashi, Norika; Sakai, Daiki; Matsuzaki, Yuto; Koshimizu, Ryo; Yamamoto, Minami; Takai, Leo; Odawara, Ryoga; Abe, Takaaki; Izumi, Shintaro; Kurihira, Naoko; Uemura, Takafumi; Kawano, Yukio; Sekitani, Tsuyoshi.
Afiliación
  • Kawabata R; SANKEN (The Institute of Scientific and Industrial Research), Osaka University, 8-1, Mihogaoka, Ibaraki-shi, Osaka, 567-0047, Japan.
  • Li K; Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka, 565-0871, Japan.
  • Araki T; Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo, 112-8551, Japan.
  • Akiyama M; SANKEN (The Institute of Scientific and Industrial Research), Osaka University, 8-1, Mihogaoka, Ibaraki-shi, Osaka, 567-0047, Japan.
  • Sugimachi K; Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka, 565-0871, Japan.
  • Matsuoka N; Advanced Photonics and Biosensing Open Innovation Laboratory, National Institute of Advanced Industrial Science and Technology (AIST), 2-1 Yamada-Oka, Suita, Osaka, 565-0871, Japan.
  • Takahashi N; SANKEN (The Institute of Scientific and Industrial Research), Osaka University, 8-1, Mihogaoka, Ibaraki-shi, Osaka, 567-0047, Japan.
  • Sakai D; Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka, 565-0871, Japan.
  • Matsuzaki Y; SANKEN (The Institute of Scientific and Industrial Research), Osaka University, 8-1, Mihogaoka, Ibaraki-shi, Osaka, 567-0047, Japan.
  • Koshimizu R; Division of Applied Science, School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka, 565-0871, Japan.
  • Yamamoto M; SANKEN (The Institute of Scientific and Industrial Research), Osaka University, 8-1, Mihogaoka, Ibaraki-shi, Osaka, 567-0047, Japan.
  • Takai L; Division of Applied Science, School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka, 565-0871, Japan.
  • Odawara R; Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo, 112-8551, Japan.
  • Abe T; Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo, 112-8551, Japan.
  • Izumi S; Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo, 112-8551, Japan.
  • Kurihira N; Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo, 112-8551, Japan.
  • Uemura T; Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo, 112-8551, Japan.
  • Kawano Y; Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo, 112-8551, Japan.
  • Sekitani T; Department of Electrical, Electronic, and Communication Engineering, Faculty of Science and Engineering, Chuo University, 1-13-27 Kasuga, Bunkyo-ku, Tokyo, 112-8551, Japan.
Adv Mater ; 36(15): e2309864, 2024 Apr.
Article en En | MEDLINE | ID: mdl-38213132
ABSTRACT
Flexible imagers are currently under intensive development as versatile optical sensor arrays, designed to capture images of surfaces and internals, irrespective of their shape. A significant challenge in developing flexible imagers is extending their detection capabilities to encompass a broad spectrum of infrared light, particularly terahertz (THz) light at room temperature. This advancement is crucial for thermal and biochemical applications. In this study, a flexible infrared imager is designed using uncooled carbon nanotube (CNT) sensors and organic circuits. The CNT sensors, fabricated on ultrathin 2.4 µm substrates, demonstrate enhanced sensitivity across a wide infrared range, spanning from near-infrared to THz wavelengths. Moreover, they retain their characteristics under bending and crumpling. The design incorporates light-shielded organic transistors and circuits, functioning reliably under light irradiation, and amplifies THz detection signals by a factor of 10. The integration of both CNT sensors and shielded organic transistors into an 8 × 8 active-sensor matrix within the imager enables sequential infrared imaging and nondestructive assessment for heat sources and in-liquid chemicals through wireless communication systems. The proposed imager, offering unique functionality, shows promise for applications in biochemical analysis and soft robotics.
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2024 Tipo del documento: Article País de afiliación: Japón Pais de publicación: Alemania
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2024 Tipo del documento: Article País de afiliación: Japón Pais de publicación: Alemania