Efficient Quantum Dot Light-Emitting Diode Enabled by a Thick Inorganic CdS Interfacial Modification Layer.

Yang, Chunyan; Ma, Rui; Wang, Zhe; Wang, Yuanyuan; Yu, Chaoyu; Liu, Yonggang; Wan, Yanfu; Li, Jianfeng; Tong, Junfeng; Zhang, Peng; Zhang, Heng

Yang, Chunyan; Ma, Rui; Wang, Zhe; Wang, Yuanyuan; Yu, Chaoyu; Liu, Yonggang; Wan, Yanfu; Li, Jianfeng; Tong, Junfeng; Zhang, Peng; Zhang, Heng.

Afiliación

Yang C; School of Materials Science and Engineering, Lanzhou Jiaotong University, Lanzhou 730000, China.
Ma R; School of Materials Science and Engineering, Lanzhou Jiaotong University, Lanzhou 730000, China.
Wang Z; State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures, Guangxi University, Nanning 530004,China.
Wang Y; School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China.
Yu C; State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures, Guangxi University, Nanning 530004,China.
Liu Y; School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China.
Wan Y; State Key Laboratory of Featured Metal Materials and Life-cycle Safety for Composite Structures, Guangxi University, Nanning 530004,China.
Li J; School of Resources, Environment and Materials, Guangxi University, Nanning 530004, China.
Tong J; School of Materials Science and Engineering, Lanzhou Jiaotong University, Lanzhou 730000, China.
Zhang P; School of Materials Science and Engineering, Lanzhou Jiaotong University, Lanzhou 730000, China.
Zhang H; School of Materials Science and Engineering, Lanzhou Jiaotong University, Lanzhou 730000, China.

ACS Appl Mater Interfaces ; 15(46): 54185-54191, 2023 Nov 22.

Article en En | MEDLINE | ID: mdl-37943303

Palabras clave

charge balance; exciton quenching; interfacial modification layer; light-emitting diode; quantum dot

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2023 Tipo del documento: Article País de afiliación: China Pais de publicación: Estados Unidos

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