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Low-Permittivity and Low-Temperature Cofired BaSO4-BaF2 Microwave Dielectric Ceramics for High-Reliability Packaged Electronics.
Wang, Wei; Shehbaz, Muhammad; Wang, Xin; Du, Chao; Xu, Diming; Shi, Zhong-Qi; Darwish, Moustafa Adel; Qiu, Hong-Song; Jin, Biao-Bing; Zhou, Tao; Chen, Ya-Wei; Liang, Qi-Xin; Zhang, Mei-Rong; Zhou, Di.
Afiliación
  • Wang W; Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, Shaanxi China.
  • Shehbaz M; Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, Shaanxi China.
  • Wang X; Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, Shaanxi China.
  • Du C; Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, Shaanxi China.
  • Xu D; Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, Shaanxi China.
  • Shi ZQ; State Key Laboratory for Mechanical Behaviour of Materials, Xi'an Jiaotong University, Xi'an 710049, Shaanxi China.
  • Darwish MA; Physics Department, Faculty of Science, Tanta University, Al-Geish st., Tanta 31527, Egypt.
  • Qiu HS; Research Institute of Superconductor Electronics (RISE), School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, Jiangsu China.
  • Jin BB; Research Institute of Superconductor Electronics (RISE), School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, Jiangsu China.
  • Zhou T; School of Electronic and Information Engineering, Hangzhou Dianzi University, Hangzhou 310018, Zhejiang China.
  • Chen YW; Shenzhen Microgate Technology Co., Ltd., Shenzhen 518118, Guangdong China.
  • Liang QX; Shenzhen Microgate Technology Co., Ltd., Shenzhen 518118, Guangdong China.
  • Zhang MR; Shenzhen Microgate Technology Co., Ltd., Shenzhen 518118, Guangdong China.
  • Zhou D; Electronic Materials Research Laboratory, Key Laboratory of the Ministry of Education & International Center for Dielectric Research, School of Electronic Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, Shaanxi China.
ACS Appl Mater Interfaces ; 2023 Oct 30.
Article en En | MEDLINE | ID: mdl-37902771
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2023 Tipo del documento: Article Pais de publicación: Estados Unidos
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2023 Tipo del documento: Article Pais de publicación: Estados Unidos