Life cycle analysis on sequential recovery of copper and gold from waste printed circuit boards.

Rao, Mudila Dhanunjaya; Meshram, Rohit B; Singh, Kamalesh K; Morrison, Carole A; Love, Jason B

Rao, Mudila Dhanunjaya; Meshram, Rohit B; Singh, Kamalesh K; Morrison, Carole A; Love, Jason B.

Afiliación

Rao MD; CSIR-National Metallurgical Laboratory, Jamshedpur 831007, India; Department of Metallurgical Engineering, Indian Institute of Technology (Banaras Hindu University), Varanasi 221005, India. Electronic address: mudila.rao@nmlindia.org.
Meshram RB; CSIR-National Metallurgical Laboratory, Jamshedpur 831007, India.
Singh KK; Department of Metallurgical Engineering, Indian Institute of Technology (Banaras Hindu University), Varanasi 221005, India. Electronic address: kksingh.met@iitbhu.ac.in.
Morrison CA; EaStCHEM School of Chemistry, University of Edinburgh, Joseph Black Building, The King's Buildings, David Brewster Road, Edinburgh EH9 3FJ, UK.
Love JB; EaStCHEM School of Chemistry, University of Edinburgh, Joseph Black Building, The King's Buildings, David Brewster Road, Edinburgh EH9 3FJ, UK.

Waste Manag ; 171: 621-627, 2023 Oct 12.

Article en En | MEDLINE | ID: mdl-37837909

Palabras clave

Hydrometallurgy; Leaching; Life cycle assessment; Recycling; Solvent extraction; WPCBs

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Waste Manag Asunto de la revista: SAUDE AMBIENTAL / TOXICOLOGIA Año: 2023 Tipo del documento: Article Pais de publicación: Estados Unidos

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