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Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films.
Ustad, Ruhan E; Chavan, Vijay D; Kim, Honggyun; Shin, Min-Ho; Kim, Sung-Kyu; Choi, Kyeong-Keun; Kim, Deok-Kee.
Afiliación
  • Ustad RE; Semiconductor Systems Engineering, Sejong University, Seoul 05006, Republic of Korea.
  • Chavan VD; Electrical Engineering and Convergence Engineering for Intelligent Drone, Sejong University, Seoul 05006, Republic of Korea.
  • Kim H; Semiconductor Systems Engineering, Sejong University, Seoul 05006, Republic of Korea.
  • Shin MH; National Institute for Nanomaterials Technology (NINT), Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea.
  • Kim SK; National Institute for Nanomaterials Technology (NINT), Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea.
  • Choi KK; National Institute for Nanomaterials Technology (NINT), Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea.
  • Kim DK; Semiconductor Systems Engineering, Sejong University, Seoul 05006, Republic of Korea.
Nanomaterials (Basel) ; 13(19)2023 Sep 26.
Article en En | MEDLINE | ID: mdl-37836283
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Año: 2023 Tipo del documento: Article Pais de publicación: Suiza
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Año: 2023 Tipo del documento: Article Pais de publicación: Suiza