Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials.

Lu, Jiadong; Zhang, Songli; Zhang, Leizhi; Wang, Chenxi; Min, Chunying

Lu, Jiadong; Zhang, Songli; Zhang, Leizhi; Wang, Chenxi; Min, Chunying.

Afiliación

Lu J; School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China.
Zhang S; School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China.
Zhang L; School of Civil Engineering, Southeast University, Nanjing 211189, China.
Wang C; School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China.
Min C; School of Materials Science & Engineering, Jiangsu University, Zhenjiang 212013, China.

Materials (Basel) ; 16(10)2023 May 16.

Article en En | MEDLINE | ID: mdl-37241395

Palabras clave

dielectric properties; electronic packaging materials; epoxy resin; hollow glass microspheres

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2023 Tipo del documento: Article País de afiliación: China Pais de publicación: Suiza

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