A Novel Grain-Based DEM Model for Evaluating Surface Integrity in Scratching of RB-SiC Ceramics.

Qi, Huan; Wang, Yuelei; Qi, Zijian; Shi, Liwu; Fang, Zhufang; Zhang, Li; Riemer, Oltmann; Karpuschewski, Bernhard

Qi, Huan; Wang, Yuelei; Qi, Zijian; Shi, Liwu; Fang, Zhufang; Zhang, Li; Riemer, Oltmann; Karpuschewski, Bernhard.

Afiliación

Qi H; College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China.
Wang Y; Department of Manufacturing Technologies, Leibniz Institute for Materials Engineering-IWT, 28359 Bremen, Germany.
Qi Z; MAPEX Center for Materials and Processes, University of Bremen, 28359 Bremen, Germany.
Shi L; State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha 410083, China.
Fang Z; College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China.
Zhang L; School of Energy Science and Engineering, Central South University, Changsha 410083, China.
Riemer O; College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China.
Karpuschewski B; College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China.

Materials (Basel) ; 15(23)2022 Nov 28.

Article en En | MEDLINE | ID: mdl-36499981

RESUMEN

A novel grain-based DEM (Discrete Element Method) model is developed and calibrated to simulate RB-SiC (Reaction-Bonded Silicon Carbide) ceramic and associated scratching process by considering the bonded SiC and Si grains and cementitious materials. It is shown that the grain-based DEM model can accurately identify transgranular and intergranular cracks, and ductile and brittle material removal modes. It also shows that by increasing the scratching speed or decreasing the depth of cut, the maximum depth of subsurface damage decreases, because the scratching force is relatively large under the low scratching speed or large depth of cut that facilitates the occurrence of transgranular cracks, large grain spalling from the target surface and the propagation of median cracks into the target subsurface. It has further been found that increasing the cutting-edge radius can enhance the target ductile machinability and reduce the target subsurface damage.

Palabras clave

RB-SiC ceramics; cluster; grain-based DEM model; scratching process; surface integrity

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2022 Tipo del documento: Article País de afiliación: China Pais de publicación: Suiza

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