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Wafer-Scale Full-Coverage Self-Limiting Assembly of Particles on Flexible Substrates.
Zhao, Liang; Sidnawi, Bchara; Fan, Jichao; Chen, Ruiyang; Scully, Thomas; Dietrich, Scott; Gao, Weilu; Wu, Qianhong; Li, Bo.
Afiliación
  • Zhao L; Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania19085, United States.
  • Sidnawi B; Hybrid Nano-Architectures and Advanced Manufacturing Laboratory, Villanova University, Villanova, Pennsylvania19085, United States.
  • Fan J; Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania19085, United States.
  • Chen R; Cellular Biomechanics and Sports Science Laboratory, Villanova University, Villanova, Pennsylvania19085, United States.
  • Scully T; Department of Electrical and Computer Engineering, The University of Utah, Salt Lake City, Utah84112, United States.
  • Dietrich S; Department of Electrical and Computer Engineering, The University of Utah, Salt Lake City, Utah84112, United States.
  • Gao W; Department of Mechanical Engineering, Villanova University, Villanova, Pennsylvania19085, United States.
  • Wu Q; Hybrid Nano-Architectures and Advanced Manufacturing Laboratory, Villanova University, Villanova, Pennsylvania19085, United States.
  • Li B; Department of Physics, Villanova University, Villanova, Pennsylvania19085, United States.
ACS Appl Mater Interfaces ; 14(40): 46095-46102, 2022 Oct 12.
Article en En | MEDLINE | ID: mdl-36174021

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2022 Tipo del documento: Article País de afiliación: Estados Unidos Pais de publicación: Estados Unidos

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2022 Tipo del documento: Article País de afiliación: Estados Unidos Pais de publicación: Estados Unidos