Built-In Packaging for Single Terminal Devices.
Sensors (Basel)
; 22(14)2022 Jul 14.
Article
en En
| MEDLINE
| ID: mdl-35890942
An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources. A micro resonator device is fabricated and built-in packaged for demonstration with electrostatic actuation and optical measurement. Identical actuation performances are achieved with the most conventional packaging method, wire bonding. The proposed method offers a compact and cheap packaging for industrial and academic applications.
Texto completo:
1
Colección:
01-internacional
Base de datos:
MEDLINE
Idioma:
En
Revista:
Sensors (Basel)
Año:
2022
Tipo del documento:
Article
País de afiliación:
Canadá
Pais de publicación:
Suiza