Direct Ink Writing for High-Efficiency Microwave Attenuation with Nanofibers Alignment.

Lim, Gwendolyn Jia Hao; Yang, Zeshi; Hou, Yi; Sugumaran, Pon Janani; Qiao, Zhi; Ding, Jun; Yan, Wentao; Yang, Yong

Lim, Gwendolyn Jia Hao; Yang, Zeshi; Hou, Yi; Sugumaran, Pon Janani; Qiao, Zhi; Ding, Jun; Yan, Wentao; Yang, Yong.

Afiliación

Lim GJH; National University of Singapore, 5A Engineering Drive 1, 117411, Singapore.
Yang Z; Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, 117575, Singapore.
Hou Y; National University of Singapore, 5A Engineering Drive 1, 117411, Singapore.
Sugumaran PJ; National University of Singapore, 5A Engineering Drive 1, 117411, Singapore.
Qiao Z; Department of Materials Science and Engineering, National University of Singapore, 9 Engineering Drive 1, 117575, Singapore.
Ding J; Department of Materials Science and Engineering, National University of Singapore, 9 Engineering Drive 1, 117575, Singapore.
Yan W; Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, 117575, Singapore.
Yang Y; Department of Materials Science and Engineering, National University of Singapore, 9 Engineering Drive 1, 117575, Singapore.

ACS Appl Mater Interfaces ; 14(27): 31267-31276, 2022 Jul 13.

Article en En | MEDLINE | ID: mdl-35767341

Palabras clave

3D printing; fiber alignment; microwave attenuation; multimaterials; silicon carbide nanowires

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2022 Tipo del documento: Article País de afiliación: Singapur Pais de publicación: Estados Unidos

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