Traditional electronic devices are composed of rigid materials and components that tend to be unsuitable for soft robotic and stretchable electronic applications, such as wearable or continuous pressure sensing. However, deformable materials have the potential to improve upon traditional devices through enhanced sensitivity and responsiveness, better conformability and biocompatibility at the human-machine interface, and greater durability. This work presents deformable composite materials composed of the gallium-indium-tin alloy galinstan (GaInSn) that combines the conductivity of a metal and the intrinsic deformability of a liquid. Dispersing galinstan in an elastomer allows for the formation of deformable dielectric materials that have tunable mechanical and electrical behavior, for example, modulus and relative permittivity. Galinstan composites have been shown previously to have a minimal modulus impact on the elastomer but concurrently achieve impressive dielectric performance. However, galinstan dispersions can be costly and face challenges of mechanical and electrical reliability. Thereby, this work investigates multimaterial composites composed of galinstan and a rigid filler, either iron or barium titanate, with respect to morphology, mechanical behavior, dielectric behavior, and pressure sensing performance for the purpose of achieving a balance between a low modulus and superior electrical performance. By combining galinstan and rigid fillers, it was found that the mechanical and electrical properties, such as modulus, permittivity, loss behavior, sensitivity, and linearity of the multimaterial composites can be improved by tuning filler formulation. This suggests that these dielectric materials can be used for sensing applications that can be precisely calibrated to specific material properties and the needs of the user. These deformable multimaterial composites, found to be stretchable and highly responsive in sensing applications, will expand the current mechanical abilities of deformable dielectric materials to improve soft robotic and stretchable electronic devices.