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Lowlight object recognition by deep learning with passive three-dimensional integral imaging in visible and long wave infrared wavelengths.
Opt Express ; 30(2): 1205-1218, 2022 Jan 17.
Article en En | MEDLINE | ID: mdl-35209285
Traditionally, long wave infrared imaging has been used in photon starved conditions for object detection and classification. We investigate passive three-dimensional (3D) integral imaging (InIm) in visible spectrum for object classification using deep neural networks in photon-starved conditions and under partial occlusion. We compare the proposed passive 3D InIm operating in the visible domain with that of the long wave infrared sensing in both 2D and 3D imaging cases for object classification in degraded conditions. This comparison is based on average precision, recall, and miss rates. Our experimental results demonstrate that cold and hot object classification using 3D InIm in the visible spectrum may outperform both 2D and 3D imaging implemented in long wave infrared spectrum for photon-starved and partially occluded scenes. While these experiments are not comprehensive, they demonstrate the potential of 3D InIm in the visible spectrum for low light applications. Imaging in the visible spectrum provides higher spatial resolution, more compact optics, and lower cost hardware compared with long wave infrared imaging. In addition, higher spatial resolution obtained in the visible spectrum can improve object classification accuracy. Our experimental results provide a proof of concept for implementing visible spectrum imaging in place of the traditional LWIR spectrum imaging for certain object recognition tasks.

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Opt Express Asunto de la revista: OFTALMOLOGIA Año: 2022 Tipo del documento: Article Pais de publicación: Estados Unidos

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Opt Express Asunto de la revista: OFTALMOLOGIA Año: 2022 Tipo del documento: Article Pais de publicación: Estados Unidos