Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions.

Matsumae, Takashi; Takigawa, Ryo; Kurashima, Yuichi; Takagi, Hideki; Higurashi, Eiji

Matsumae, Takashi; Takigawa, Ryo; Kurashima, Yuichi; Takagi, Hideki; Higurashi, Eiji.

Afiliación

Matsumae T; Device Research Technology Institute, National Institute of Advanced Industrial Science and Technology, Ibaraki, 305-8564, Japan. t.matsumae@aist.go.jp.
Takigawa R; Graduate School of Information Science and Electrical Engineering, Kyushu University, 744 Motooka, Nishi-ku, Fukuoka, 819-0395, Japan. takigawa@ed.kyushu-u.ac.jp.
Kurashima Y; Device Research Technology Institute, National Institute of Advanced Industrial Science and Technology, Ibaraki, 305-8564, Japan.
Takagi H; Device Research Technology Institute, National Institute of Advanced Industrial Science and Technology, Ibaraki, 305-8564, Japan.
Higurashi E; Device Research Technology Institute, National Institute of Advanced Industrial Science and Technology, Ibaraki, 305-8564, Japan.

Sci Rep ; 11(1): 11109, 2021 May 27.

Article en En | MEDLINE | ID: mdl-34045611

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Rep Año: 2021 Tipo del documento: Article País de afiliación: Japón Pais de publicación: Reino Unido

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