Your browser doesn't support javascript.
loading
Sub-thermionic, ultra-high-gain organic transistors and circuits.
Luo, Zhongzhong; Peng, Boyu; Zeng, Junpeng; Yu, Zhihao; Zhao, Ying; Xie, Jun; Lan, Rongfang; Ma, Zhong; Pan, Lijia; Cao, Ke; Lu, Yang; He, Daowei; Ning, Hongkai; Meng, Wanqing; Yang, Yang; Chen, Xiaoqing; Li, Weisheng; Wang, Jiawei; Pan, Danfeng; Tu, Xuecou; Huo, Wenxing; Huang, Xian; Shi, Dongquan; Li, Ling; Liu, Ming; Shi, Yi; Feng, Xue; Chan, Paddy K L; Wang, Xinran.
Afiliación
  • Luo Z; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Peng B; Department of Mechanical Engineering, The University of Hongkong, Pok Fu Lam Road, Hong Kong, China.
  • Zeng J; MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, 310027, China.
  • Yu Z; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Zhao Y; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Xie J; College of Electronic and Optical Engineering, Nanjing University of Posts and Telecommunications, Nanjing, 210023, China.
  • Lan R; Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
  • Ma Z; Department of Cardiology, Nanjing Drum Tower Hospital, The Affiliated Hospital of Nanjing University Medical School, Nanjing, 210093, China.
  • Pan L; Department of Cardiology, Nanjing Drum Tower Hospital, The Affiliated Hospital of Nanjing University Medical School, Nanjing, 210093, China.
  • Cao K; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Lu Y; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • He D; Department of Mechanical Engineering, City University of Hong Kong, Kowloon, Hong Kong, China.
  • Ning H; Department of Mechanical Engineering, City University of Hong Kong, Kowloon, Hong Kong, China.
  • Meng W; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Yang Y; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Chen X; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Li W; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Wang J; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Pan D; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Tu X; Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
  • Huo W; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Huang X; Microfabrication and Integration Technology Center, Nanjing University, Nanjing, 210093, China.
  • Shi D; National Laboratory of Solid-State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Li L; Microfabrication and Integration Technology Center, Nanjing University, Nanjing, 210093, China.
  • Liu M; Department of Biomedical Engineering, Tianjin University, Tianjin, 300072, China.
  • Shi Y; Department of Biomedical Engineering, Tianjin University, Tianjin, 300072, China.
  • Feng X; Department of Sports Medicine and Adult Reconstructive Surgery, Nanjing Drum Tower Hospital, The Affiliated Hospital of Nanjing University Medical School, Nanjing, 210093, China.
  • Chan PKL; Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
  • Wang X; Key Laboratory of Microelectronics Devices and Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Nat Commun ; 12(1): 1928, 2021 03 26.
Article en En | MEDLINE | ID: mdl-33772009
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2021 Tipo del documento: Article País de afiliación: China Pais de publicación: Reino Unido
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2021 Tipo del documento: Article País de afiliación: China Pais de publicación: Reino Unido