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Enhanced Thermoelectric Performance in the Ba0.3Co4Sb12/InSb Nanocomposite Originating from the Minimum Possible Lattice Thermal Conductivity.
Ghosh, Sanyukta; Shankar, Gyan; Karati, Anirudha; Werbach, Katharina; Rogl, Gerda; Rogl, Peter; Bauer, Ernst; Murty, B S; Suwas, Satyam; Mallik, Ramesh Chandra.
Afiliación
  • Ghosh S; Thermoelectric Materials and Devices Laboratory, Department of Physics, Indian Institute of Science, Bangalore 560012, India.
  • Shankar G; Department of Materials Engineering, Indian Institute of Science, Bangalore 560012, India.
  • Karati A; Department of Chemistry, Indian Institute of Technology, Chennai 600036, India.
  • Werbach K; Institute of Materials Chemistry, University of Vienna, Waehringerstrasse 42, Wien 1090, Austria.
  • Rogl G; Institute of Materials Chemistry, University of Vienna, Waehringerstrasse 42, Wien 1090, Austria.
  • Rogl P; Institute of Solid State Physics, TU-Wien, Wien 1040, Austria.
  • Bauer E; Institute of Materials Chemistry, University of Vienna, Waehringerstrasse 42, Wien 1090, Austria.
  • Murty BS; Institute of Solid State Physics, TU-Wien, Wien 1040, Austria.
  • Suwas S; Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Chennai 600036, India.
  • Mallik RC; Department of Materials Engineering, Indian Institute of Science, Bangalore 560012, India.
ACS Appl Mater Interfaces ; 12(43): 48729-48740, 2020 Oct 28.
Article en En | MEDLINE | ID: mdl-33073561
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2020 Tipo del documento: Article País de afiliación: India Pais de publicación: Estados Unidos
Texto completo
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2020 Tipo del documento: Article País de afiliación: India Pais de publicación: Estados Unidos