Temperature-resilient solid-state organic artificial synapses for neuromorphic computing.

Melianas, A; Quill, T J; LeCroy, G; Tuchman, Y; Loo, H V; Keene, S T; Giovannitti, A; Lee, H R; Maria, I P; McCulloch, I; Salleo, A

Melianas, A; Quill, T J; LeCroy, G; Tuchman, Y; Loo, H V; Keene, S T; Giovannitti, A; Lee, H R; Maria, I P; McCulloch, I; Salleo, A.

Afiliación

Melianas A; Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA. armantas.melianas@stanford.edu asalleo@stanford.edu.
Quill TJ; Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA.
LeCroy G; Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA.
Tuchman Y; Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA.
Loo HV; Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA.
Keene ST; Zernike Institute for Advanced Materials, University of Groningen, 9747AG Groningen, Netherlands.
Giovannitti A; Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA.
Lee HR; Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA.
Maria IP; Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA.
McCulloch I; Department of Chemistry and Centre for Plastic Electronics, Imperial College London, London, UK.
Salleo A; Department of Chemistry and Centre for Plastic Electronics, Imperial College London, London, UK.

Sci Adv ; 6(27)2020 Jul.

Article en En | MEDLINE | ID: mdl-32937458

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Sci Adv Año: 2020 Tipo del documento: Article Pais de publicación: Estados Unidos

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