The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer.

Chen, Zhixiang; Cao, Linlin; Yuan, Julong; Lyu, Binghai; Hang, Wei; Wang, Jiahuan

Chen, Zhixiang; Cao, Linlin; Yuan, Julong; Lyu, Binghai; Hang, Wei; Wang, Jiahuan.

Afiliación

Chen Z; Ultra-Precision Machining Centre, College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China.
Cao L; Ultra-Precision Machining Centre, College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China.
Yuan J; Ultra-Precision Machining Centre, College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China.
Lyu B; Ultra-Precision Machining Centre, College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China.
Hang W; Ultra-Precision Machining Centre, College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China.
Wang J; Ultra-Precision Machining Centre, College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310014, China.

Micromachines (Basel) ; 11(8)2020 Aug 06.

Article en En | MEDLINE | ID: mdl-32781686

Palabras clave

adhesion force; double-sides polishing; layer stacked clamping (LSC); ultra-thin sapphire

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Micromachines (Basel) Año: 2020 Tipo del documento: Article País de afiliación: China Pais de publicación: Suiza

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