Bioinspired Adhesive Architectures: From Skin Patch to Integrated Bioelectronics.

Baik, Sangyul; Lee, Heon Joon; Kim, Da Wan; Kim, Ji Won; Lee, Youngkwan; Pang, Changhyun

Baik, Sangyul; Lee, Heon Joon; Kim, Da Wan; Kim, Ji Won; Lee, Youngkwan; Pang, Changhyun.

Afiliación

Baik S; School of Chemical Engineering, Sungkyunkwan University (SKKU), Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do, 16419, Republic of Korea.
Lee HJ; School of Chemical Engineering, Sungkyunkwan University (SKKU), Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do, 16419, Republic of Korea.
Kim DW; School of Chemical Engineering, Sungkyunkwan University (SKKU), Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do, 16419, Republic of Korea.
Kim JW; School of Chemical Engineering, Sungkyunkwan University (SKKU), Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do, 16419, Republic of Korea.
Lee Y; School of Chemical Engineering, Sungkyunkwan University (SKKU), Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do, 16419, Republic of Korea.
Pang C; School of Chemical Engineering, Sungkyunkwan University (SKKU), Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do, 16419, Republic of Korea.

Adv Mater ; 31(34): e1803309, 2019 Aug.

Article en En | MEDLINE | ID: mdl-30773697

Asunto(s)

Adhesivos/química; Materiales Biomiméticos/química; Parche Transdérmico; Animales; Técnicas Biosensibles/instrumentación; Técnicas Biosensibles/métodos; Electrónica; Humanos; Polímeros/química

Palabras clave

bioelectronics; biomimetics; dry adhesives; nanostructures; skin patches

Texto completo

Añadir a Mi BVS

Imprimir

XML

PubMed Links

Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Asunto principal: Adhesivos / Materiales Biomiméticos / Parche Transdérmico Límite: Animals / Humans Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2019 Tipo del documento: Article Pais de publicación: Alemania

Texto completo

Añadir a Mi BVS

Imprimir

XML

PubMed Links

Buscar en Google