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Lead-Free All-Inorganic Cesium Tin Iodide Perovskite for Filamentary and Interface-Type Resistive Switching toward Environment-Friendly and Temperature-Tolerant Nonvolatile Memories.
Han, Ji Su; Le, Quyet Van; Choi, Jaeho; Kim, Hyojung; Kim, Sun Gil; Hong, Kootak; Moon, Cheon Woo; Kim, Taemin Ludvic; Kim, Soo Young; Jang, Ho Won.
Afiliación
  • Han JS; Department of Materials Science and Engineering, Research Institute of Advanced Materials , Seoul National University , Seoul 08826 , Republic of Korea.
  • Le QV; School of Chemical Engineering and Materials Science , Chung-Ang University , Seoul 06974 , Republic of Korea.
  • Choi J; Institute of Research and Development , Duy Tan University , Da Nang 550000 , Vietnam.
  • Kim H; Department of Materials Science and Engineering, Research Institute of Advanced Materials , Seoul National University , Seoul 08826 , Republic of Korea.
  • Kim SG; Department of Materials Science and Engineering, Research Institute of Advanced Materials , Seoul National University , Seoul 08826 , Republic of Korea.
  • Hong K; Department of Materials Science and Engineering, Research Institute of Advanced Materials , Seoul National University , Seoul 08826 , Republic of Korea.
  • Moon CW; Department of Materials Science and Engineering, Research Institute of Advanced Materials , Seoul National University , Seoul 08826 , Republic of Korea.
  • Kim TL; Department of Materials Science and Engineering, Research Institute of Advanced Materials , Seoul National University , Seoul 08826 , Republic of Korea.
  • Kim SY; Department of Materials Science and Engineering, Research Institute of Advanced Materials , Seoul National University , Seoul 08826 , Republic of Korea.
  • Jang HW; School of Chemical Engineering and Materials Science , Chung-Ang University , Seoul 06974 , Republic of Korea.
ACS Appl Mater Interfaces ; 11(8): 8155-8163, 2019 Feb 27.
Article en En | MEDLINE | ID: mdl-30698005
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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2019 Tipo del documento: Article Pais de publicación: Estados Unidos
Texto completo
Añadir a Mi BVS
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2019 Tipo del documento: Article Pais de publicación: Estados Unidos