Advances in Materials for Recent Low-Profile Implantable Bioelectronics.

Chen, Yanfei; Kim, Yun-Soung; Tillman, Bryan W; Yeo, Woon-Hong; Chun, Youngjae

Chen, Yanfei; Kim, Yun-Soung; Tillman, Bryan W; Yeo, Woon-Hong; Chun, Youngjae.

Afiliación

Chen Y; Department of Industrial Engineering, Swanson School of Engineering, University of Pittsburgh, Pittsburgh, PA 15261, USA. yanfeichen@pitt.edu.
Kim YS; George W. Woodruff School of Mechanical Engineering, College of Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA. ysk@me.gatech.edu.
Tillman BW; Division of Vascular Surgery, University of Pittsburgh Medical Center, Pittsburgh, PA 15260, USA. tillmanbw@upmc.edu.
Yeo WH; McGowan Institute for Regenerative Medicine, University of Pittsburgh, Pittsburgh, PA 15261, USA. tillmanbw@upmc.edu.
Chun Y; George W. Woodruff School of Mechanical Engineering, College of Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA. whyeo@gatech.edu.

Materials (Basel) ; 11(4)2018 Mar 29.

Article en En | MEDLINE | ID: mdl-29596359

Palabras clave

biodegradable materials; implantable materials; low-profile bioelectronics; medical devices; micro/nanofabrication; miniaturization

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2018 Tipo del documento: Article País de afiliación: Estados Unidos Pais de publicación: Suiza

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