Anisotropy of Single-Crystal Silicon in Nanometric Cutting.

Wang, Zhiguo; Chen, Jiaxuan; Wang, Guilian; Bai, Qingshun; Liang, Yingchun

Wang, Zhiguo; Chen, Jiaxuan; Wang, Guilian; Bai, Qingshun; Liang, Yingchun.

Afiliación

Wang Z; School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China. wzg1977sohu@163.com.
Chen J; School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China. chenjiaxuan@hit.edu.cn.
Wang G; College of Mechanical Engineering, Tianjin University of Technology, Tianjin, 300384, People's Republic of China.
Bai Q; School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China.
Liang Y; School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China.

Nanoscale Res Lett ; 12(1): 300, 2017 Dec.

Article en En | MEDLINE | ID: mdl-28449540

Palabras clave

Anisotropy behavior; Chip; Molecular dynamics simulation; Nanometric cutting; Single-crystal silicon; Subsurface damage

Texto completo

Añadir a Mi BVS

Imprimir

XML

PubMed Links

Buscar en Google

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Nanoscale Res Lett Año: 2017 Tipo del documento: Article Pais de publicación: Estados Unidos

Texto completo

Añadir a Mi BVS

Imprimir

XML

PubMed Links

Buscar en Google