Deep sub micrometer imaging of defects in copper pillars by X-ray tomography in a SEM.

Laloum, D; Lorut, F; Bertheau, J; Audoit, G; Bleuet, P

Laloum, D; Lorut, F; Bertheau, J; Audoit, G; Bleuet, P.

Afiliación

Laloum D; STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France; CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France. Electronic address: david.laloum@cea.fr.
Lorut F; STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France.
Bertheau J; STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles, France; CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France.
Audoit G; CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France.
Bleuet P; CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France.

Micron ; 58: 1-8, 2014 Mar.

Article en En | MEDLINE | ID: mdl-24316374

Palabras clave

3D integration; Copper pillar; Nanotomography; Plasma FIB; SEM; X-ray

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Micron Asunto de la revista: DIAGNOSTICO POR IMAGEM Año: 2014 Tipo del documento: Article Pais de publicación: Reino Unido

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