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Molecular crystals capable of colossal thermal expansion (TE) are fascinating owing to their substantial and continuous volume changes and reasonably linear responses to temperature. This makes them promising candidates for micromachine applications. Macroscopic motion is driven by subtle yet cooperative movements of molecules that respond to the thermal motions of dynamic functional units. The study of p-TIPS-DSB presented here offers a compelling case highlighting the relationship between the degree of dynamicity of functional units and TE behavior. In its α-phase, the p-TIPS-DSB crystal undergoes an irreversible martensitic transition to the ß-phase, accompanied by significant cooperative interlayer shear. This process substantially enhances the mobility of the side-chains driven by the increased free volume surrounding them. This nearly doubles the volumetric TE coefficient from 255.3 (10) to 444.9 (32) MK-1, particularly in the actuation direction from 175.0 (7) to 291.7 (20) MK-1, enabling about 4.5% elongation/contraction. As demonstrated here, p-TIPS-DSB exhibits a decent force density (> 1.4 × 107 N m-3) and precise motion control capabilities due to its hysteresis-free and non-abrupt TE nature. Furthermore, we demonstrated the limited operating distance of colossal TE materials can be amplified by utilizing levers, highlighting the high potential of these materials for use in micromachines.
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A precise prediction of the cure-induced shrinkage of an epoxy resin is performed using a finite element simulation procedure for the material behaviour. A series of experiments investigating the cure shrinkage of the resin system has shown a variation in the measured cure-induced strains. The observed variation results from the thermal history during the pre-cure. A proposed complex thermal expansion model and a conventional chemical shrinkage model are utilised to predict the cure shrinkage observed with finite element simulations. The thermal expansion model is fitted to measured data and considers material effects such as the glass transition temperature and the evolution of the expansion with the degree of cure. The simulations accurately capture the exothermal heat release from the resin and the cure-induced strains across various temperature profiles. The simulations follow the experimentally observed behaviour. The simulation predictions achieve good accuracy with 2-6% discrepancy compared with the experimentally measured shrinkage over a wide range of cure profiles. Demonstrating that the proposed complex thermal expansion model affects the potential to minimise the shrinkage of the studied epoxy resin. A recommendation of material parameters necessary to accurately determine cure shrinkage is listed. These parameters are required to predict cure shrinkage, allow for possible minimisation, and optimise cure profiles for the investigated resin system. Furthermore, in a study where the resin movement is restrained and therefore able to build up residual stresses, these parameters can describe the cure contribution of the residual stresses in a component.
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Laser-based powder bed fusion of metals (PBF-LB/M) is a widely used additive manufacturing process characterized by a high degree of design freedom. As a result, near fully dense complex components can be produced in near-net shape by PBF-LB/M. Recently, the PBF-LB/M process was found to be a promising candidate to overcome challenges related to conventional machining of the Fe64Ni36 Invar alloy being well known for a low coefficient of thermal expansion (CTE). In this context, a correlation between process-induced porosity and the CTE was presumed in several studies. Therefore, the present study investigates whether the unique thermal properties of the PBF-LB/M-processed Fe64Ni36 Invar alloy can be tailored by the selective integration of defects. For this purpose, a full-factorial experimental design, representing by far the largest processing window in the literature, was considered, correlating the thermal expansion properties with porosity and hardness. Furthermore, the microstructure and mechanical properties were investigated by scanning electron microscopy and quasi-static tensile tests. Results by means of statistical analysis reveal that a systematic correlation between porosity and CTE properties could not be determined. However, by using specific process parameter combinations, the microstructure changed from a fine-grained fan-like structure to a coarse columnar structure.
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Silicate-based multicomponent glasses are of high interest for technical applications due to their tailored properties, such as an adaptable refractive index or coefficient of thermal expansion. However, the production of complex structured parts is associated with high effort, since glass components are usually shaped from high-temperature melts with subsequent mechanical or chemical postprocessing. Here for the first time the fabrication of binary and ternary multicomponent glasses using doped nanocomposites based on silica nanoparticles and photocurable metal oxide precursors as part of the binder matrix is presented. The doped nanocomposites are structured in high resolution using UV-casting and additive manufacturing techniques, such as stereolithography and two-photon lithography. Subsequently, the composites are thermally converted into transparent glass. By incorporating titanium oxide, germanium oxide, or zirconium dioxide into the silicate glass network, multicomponent glasses are fabricated with an adjustable refractive index nD between 1.4584-1.4832 and an Abbe number V of 53.85-61.13. It is further demonstrated that by incorporating 7 wt% titanium oxide, glasses with ultralow thermal expansion can be fabricated with so far unseen complexity. These novel materials enable for the first time high-precision lithographic structuring of multicomponent silica glasses with applications from optics and photonics, semiconductors as well as sensors.
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The coefficient of thermal expansion (CTE) of adhesives is considered to be a vital parameter for dental restoration due to the oral temperature fluctuation induced by hot and cold drinks in daily life. Even more challenging, the adhesives need to bond various materials with different CTE values, and mismatched thermal expansion at the interface of two materials will produce thermal stress and cause cracking, leading to bond failure. In this study, we designed and synthesized a divinyl monomer containing a dibenzocyclooctadiene (DBCOD) unit, which was incorporated into a commercial adhesive, Single Bond Universal (SBU) to prepare low CTE adhesives. The CTE value of the adhesives can be adjusted low to 6.5 ppm/K, which is much lower than that of pure SBU. Mimicking the real applying conditions, the composite resin columns were bonded to the zirconia ceramics as a dental crown with our designed adhesives, and the shear bond strength test was carried out before and after 10 000 thermal cycles between 5 and 55 °C. The shear bond strength of pure SBU retains 44.7% of its original value after 10 000 thermal cycles, while those low CTE adhesives retain 74.6% and 61.9% of shear bond strength due to less deformation and interfacial stress during thermocycling. The newly designed adhesives provide a persistent way to enhance the shear bond strength and achieve a long lifetime in tooth restoration.
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Rapid advancements in electronic devices yield an urgent demand for high-performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the requirements simultaneously. Here, an effective strategy is proposed for significantly promoting the thermal conductivity and machinability of negative thermal expansion alloy (Zr,Nb)Fe2 through eutectic precipitation of copper networks. The eutectic dual-phase alloy exhibits an isotropic chips-matched thermal expansion coefficient and a thermal conductivity enhancement exceeding 200% compared with (Zr,Nb)Fe2, along with an ultimate compressive strength of 550 MPa. The addition of copper reorganizes the composition of (Zr,Nb)Fe2, which smooths the magnetic transition and shifts it toward higher temperature, resulting in linear low thermal expansion in a wide temperature range. The highly fine eutectic copper lamellae construct high thermal conductivity networks within (Zr,Nb)Fe2, serving as highways for heat transfer electrons and phonons. The in situ forming of eutectic copper lamellae also facilitates the mechanical properties by enhancing interfacial bonding and bearing additional stress after yielding of (Zr,Nb)Fe2. This work provides a novel strategy for promoting thermal conductivity and mechanical properties of negative thermal expansion alloys via eutectic precipitation of copper networks.
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Protonic ceramic fuel cells (PCFCs) offer a promising, clean, and efficient energy conversion solution. However, thermal mismatch between cathodes and electrolytes remains a critical obstacle, leading to interfacial damage such as cracking and delamination. Incorporating negative thermal expansion (NTE) materials into the cathode can mitigate this issue. The challenge lies in integrating NTE materials without compromising electrochemical performance or causing unwanted reactions during sintering. This study introduces a novel BaFe0.9Zr0.1O3-δ (BFZ)-NdMnO3-δ composite cathode fabricated using an ultrafast high-temperature sintering (UHS) process. This approach mitigates thermal expansion while boosting the cathode's catalytic activity compared to a single-phase BFZ cathode. The resulting fuel cell achieves a high peak power density of â¼550 mW cm-2 at 600 °C and demonstrates excellent stability during a 100 h test at 550 °C. These findings highlight the potential of UHS for developing high-performance, thermally compatible cathode materials that advance the field of PCFCs.
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Chromium-plated diamond/copper composite materials, with Cr layer thicknesses of 150 nm and 200 nm, were synthesized using a vacuum hot-press sintering process. Comparative analysis revealed that the thermal conductivity of the composite material with a Cr layer thickness of 150 nm increased by 266%, while that with a Cr layer thickness of 200 nm increased by 242%, relative to the diamond/copper composite materials without Cr plating. This indicates that the introduction of the Cr layer significantly enhanced the thermal conductivity of the composite material. The thermal properties of the composite material initially increased and subsequently decreased with rising sintering temperature. At a sintering temperature of 1050 °C and a diamond particle size of 210 µm, the thermal conductivity of the chromium-plated diamond/copper composite material reached a maximum value of 593.67 Wâm-1âK-1. This high thermal conductivity is attributed to the formation of chromium carbide at the interface. Additionally, the surface of the diamond particles in contact with the carbide layer exhibited a continuous serrated morphology due to the interface reaction. This "pinning effect" at the interface strengthened the bonding between the diamond particles and the copper matrix, thereby enhancing the overall thermal conductivity of the composite material.
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The coefficients of piezoelectricity and thermal expansion are generally positive due to the bond anharmonicity. For converse piezoelectricity, the electrostrain obtained in prevalent ceramics is only around 1%. Here we propose that the coordination transition of metal cations may make a paradigm shift. Through first-principles calculations, we predict a series of low-energy phases with distinct coordinations for Ag ions in superionic conductor AgCrX2 (X = S, Se), including ferroelectric and nonpolar phases with distinct interlayer distances. The mobile feature of Ag ions, which can be attributed to its complex coordination chemistry, can facilitate transformation between various coordination phases. Such facile transitions with ultralow barriers can be driven by applying either pressure, an electric field, or a change in temperature, giving rise to various exotic effects, including electrostrain, negative piezoelectricity, and negative thermal expansion. All with unprecedented giant constants, those mechanisms stem from the coordination transitions, distinct from the weak linear effects in previous reports.
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: Design of material showing contraction upon heating is highly challenging due to varying mechanism. However, imidazole is found to be a potential molecule that may provide low CTE materials when incorporated in the matrix.Here we have reported thermal expansion property of imidazolium salts of five aliphaticα, ω-alkane dicarboxylic acids and three aromatic acids. Either uniaxial or biaxial negative thermal expansion (NTE) has been observed in most of the salts. In some cases, axial zero thermal expansion (ZTE) has been observed. The role of imidazolium moiety for the anomalous thermal expansion behaviour of the salts has been analyzed in this study. The controlled TE behaviour of the salts is attributed to the hydrogen bonding and transverse vibration in all imidazolium salts. Owing to the high transverse vibration observed in imidazolium ion as well as the heavier oxygen atoms of acids in each case, the distance between hydrogen bonded atoms decreases - which provides either low expansion or contraction along one of the principal axes.
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Recently, single-band ratiometric (SBR) thermometry has emerged as an innovative approach to traditional fluorescence thermometry, overcoming uncertainties associated with emission spectrum overlap or scattering while maintaining high spatial resolution and remote monitoring. This paper presents a novel Cs2NaEuCl6 perovskite prepared through a slow-cooling solution method. Additionally, it proposes a temperature sensor model that relies on the thermal quenching of charge-transfer state absorption. Mechanical studies highlight the role of lattice positive thermal expansion in affecting Eu3+ emission. Conversely, a significant emission enhancement is observed upon excitation corresponding to both the ground state and excited state absorption. The distinct luminescent behavior of this Eu3+-activated halide perovskite model makes it suitable for developing a highly sensitive SBR-type sensor with a relative sensitivity (Sr) exceeding 1.5% K-1 and temperature resolution (ð¿T) below 1 K at room temperature. Furthermore, it demonstrates the thermal stability during multiple heating-cooling cycles. Finally, the practical applicability of the proposed SBR model is demonstrated by employing a self-manufactured film sensor that enables precise real-time temperature detection for electronic components. The work is regarded as a significant stride toward the development of cutting-edge and exquisitely sensitive thermometers based on lanthanide-based halide double perovskites.
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Wood characterized by desired mechanical properties and wood joining material is essential for creating wooden structures. The polymer adhesives are suitable for such applications due to the possibility of energy dissipation from stresses generated by wooden structures and the elimination of thermal bridging, which are common problems in metal joining materials. This research focuses on the thermophysical properties of the laboratory-prepared flexible and rigid polyurethanes to select an appropriate polymer adhesive. Our results showed that the highest thermal stability was in the case of the new PSTF-S adhesive, which reached 230 °C, but the lowest mass loss in the air environment was around 54% for the PS material. The mean thermal expansion coefficient for F&R PU adhesives was 124-164â10-6 K-1. The thermal diffusivity of examined adhesives varied between 0.100 and 0.180 mm2s-1. The thermal conductivity, depending on the type of polyurethane, was in the 0.13-0.29 Wâm-1âK-1 range. The relative decrease in thermal diffusivity after heating the adhesives to 150 °C was from 2% for materials with the lowest diffusivity to 23% for the PU with the highest value of heat transfer. It was found that such data can be used to simulate wooden construction joints in future research.
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A series of ester-linked tetracarboxylic dianhydrides containing multiple para-phenylene units (TA-pPhs) was synthesized to obtain novel modified polyimides, namely poly(ester imide)s (PEsIs). The flame retardancy and film toughness of PEsIs tended to deteriorate with the structural extension of the repeating units (or monomers) via ester groups. To identify the structural factors necessary for achieving the highest flame retardancy rank (UL-94, V-0), we systematically investigated the structure-property relationships of a series of TA-pPh-based PEsIs. Among them, a PEsI derived from para-quaterphenylene-containing TA-pPh (TA-DPQP) and p-phenylenediamine (p-PDA) exhibited the best property combination, featuring an extremely high glass transition temperature (Tg), very low linear coefficient of thermal expansion (CTE), low water uptake (WA), ultralow linear coefficient of humidity (hygroscopic) expansion (CHE), unexpectedly high film toughness, and excellent flame retardancy (V-0 rank). Moreover, we examined the effects of substituents of TA-pPh and discussed the mode of action for the increased film toughness. This study also investigated the structure-property relationship for a series of PEsIs derived from isomeric naphthalene-containing tetracarboxylic dianhydrides. Some of the PEsIs obtained in this study, such as the TA-DPQP/p-PDA system, hold promise as novel high-temperature dielectric substrates for use in flexible printed circuits.
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The effects of complex well conditions in shale oil wells on the swelling and tribological properties of high-acrylonitrile stator rubber used in screw pumps were investigated in this study. Tests were conducted considering the combined effects of immersion medium, temperature, and duration. The key parameters measured included mass change rate, volume change rate, hardness, elongation at break, tensile strength, surface micro-morphology of the rubber after thermal expansion and swelling, friction coefficient, and wear quantity. The results indicated that in the actual well fluids, the mass change rate of high-acrylonitrile rubber ranged from -1.08% to 1.29%, with a maximum volume change rate of 2.78%. In diesel oil, the greatest mass change rate of the rubber was 4.68%, and the volume change rate did not exceed ±1%, indicating superior swelling resistance. In both actual well fluids and diesel oil, the maximum decreases in hardness were 8.7% and 9.5%, respectively. Tensile strength and elongation at break decreased with increasing immersion temperature, with elongation at break in 80 °C diesel oil decreasing by over 50%, indicating a significant decline in the tensile properties of the rubber. The average friction coefficient of rubber specimens immersed in actual well fluids at three temperatures, as well as in diesel oil at 25 and 50 °C, decreased compared with the high-acrylonitrile rubber without thermal expansion and swelling. However, the average friction coefficient of rubber specimens immersed in diesel oil at 80 °C increased. The wear quantity of the rubber increased following immersion in both media. Additionally, the friction coefficient and wear quantity of the rubber increased with increasing immersion temperatures. The results of the study can offer valuable insights into assessing the durability of properties in high-acrylonitrile stator rubber under complex well conditions.
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First-principles molecular dynamics (FPMD) simulations were applied for analyzing structural evolutions around the paraelectric-ferroelectric phase transition temperature in the perovskite-type cadmium titanate, CdTiO3. Since the phase transition is reported to occur at the low temperature around 80 K, the quantum thermal bath (QTB) method was utilized in this study, which incorporates the nuclear quantum effects (NQEs). The structural evolutions in the QTB-FPMD simulations are in reasonable agreement with the experimental results, by contrast in the conventional FPMD simulations using the classical thermal bath (CTB-FPMD). Especially, the non-linear thermal expansion of lattice constants around the phase transition temperature was well reproduced in the QTB-FPMD with the NQEs. Thus, the NQEs are of importance in phase transitions at low temperatures, particularly below the room temperature, and the QTB is useful in that it incorporates the NQEs in MD simulations with low computational costs comparable to the conventional CTB.
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Negative-tone photosensitive polyimides (PSPIs) with a low coefficient of thermal expansion (CTE) were prepared by dissolving polyimide precursor-poly(amide ester) (PAE) resins, photoinitiators, photocrosslinkers and other additives in organic solvents. Using triamine as a monomer and dianhydride and diamine as polycondensates, tri-branched structure PAE resins with different molecular weights named PAE-1~5 were prepared. A series of corresponding PSPI films named PSPI-1~5 were prepared from PAE-1~5 resins with the same formulation, respectively. The PSPI-1~5 films prepared from resins of this structure have excellent mechanical, thermal and electrical properties after being thermally cured at 350 °C/2 h in nitrogen. The PSPI-1~5 films' coating solution also show good photolithographic performance and are able to obtain photolithographic patterns with a resolution of about 10 µm after homogenization, exposure and development. Among the PSPI-1~5 films, PSPI-2 has the most excellent lithographic properties with a weight average molecular weight (Mw) of 2.9 × 104 g/mol, a CTE of 41 ppk/°C, a glass transition temperature (Tg) of 343 °C and a 5% weight loss temperature (Td5) of 520 °C, making it suitable for industrial scale-up. The mechanical properties of elongation at breakage of 42.4%, tensile moduli of 3.4 GPa and tensile strength of 153.7 MPa were also measured.
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This research investigates the impact of solution concentration and solution-to-binder ratio (S/B) on the volume changes in alkali-activated slags with sodium hydroxide at 20 °C. Autogenous and thermal strains are monitored with a customized testing device in which thermal variations are controlled. Consequently, both the autogenous strain and coefficient of thermal expansion (CTE) are determined. Heat flow and internal relative humidity (IRH) are also monitored in parallel, making this research a multifaceted study. The magnitudes of autogenous strain and CTE are higher than those of ordinary Portland cement paste. Decreasing the solution concentration or S/B generally decreases the autogenous strain (swelling and shrinkage) and the CTE. The shrinkage amounted to 87 to 1981 µm/m, while the swelling reached between 27 and 295 µm/m and was only present in half of the compositions. The amplitude of the CTE, which increases up to 55 µm/m/°C for some compositions while the CTE of OPC remains between 20 and 25 µm/m/°C, can be explained by the high CTE of the solution in comparison with water. The IRH of paste cannot explain the autogenous strain's development alone. Increasing S/B eliminates the self-desiccation-related decrease.
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Current reports of thermal expansion coefficients (TEC) of two-dimensional (2D) materials show large discrepancies that span orders of magnitude. Determining the TEC of any 2D material remains difficult due to approaches involving indirect measurement of samples that are atomically thin and optically transparent. We demonstrate a methodology to address this discrepancy and directly measure TEC of nominally monolayer epitaxial WSe2 using four-dimensional scanning transmission electron microscopy (4D-STEM). Experimentally, WSe2 from metal-organic chemical vapor deposition (MOCVD) was heated through a temperature range of 18-564 °C using a barrel-style heating sample holder to observe temperature-induced structural changes without additional alterations or destruction of the sample. By combining 4D-STEM measurements with quantitative structural analysis, the thermal expansion coefficient of nominally monolayer polycrystalline epitaxial 2D WSe2 was determined to be (3.5 ± 0.9) × 10-6 K-1 and (5.7 ± 2) × 10-5 K-1 for the in- and out-of-plane TEC, respectively, and (3.6 ± 0.2) × 10-5 K-1 for the unit cell volume TEC, in good agreement with historically determined values for bulk crystals.
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Negative thermal expansion (NTE) compounds provide a solution for the mismatch of coefficients of thermal expansion in highly integrated device design. However, the current NTE compounds are rare, and how to effectively design new NTE compounds is still challenging. Here, a new concept is proposed to design NTE compounds, that is, to increase the flexibility of framework structure by expanding the space in framework structure compounds. Taking the parent compound NaZr2(PO4)3 as a case, a new NTE system AIBIICIII(MoO4)3 (A = Li, Na, K, and Rb; B = Mg and Mn; C = Sc, In, and Lu) is designed. In these compounds, the large volume of MoO4 tetrahedron is used to replace the small volume of PO4 tetrahedron in NaZr2(PO4)3 to enhance structural space and NTE performance. Simultaneously, a joint study of temperature-dependent X-ray diffraction, Raman spectroscopy, and the first principles calculation reveals that the NTE in AIBIICIII(MoO4)3 series compounds arise from the coupled oscillation of polyhedral. Large-radius ions are conducive to enhancing the space and softening the framework structure to achieve the enhancement of NTE. The current strategy for designing NTE compounds is expected to be adopted in other compounds to obtain more NTE compounds.
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Much effort is made to achieve the negative thermal expansion (NTE) control, but rare methods reached the improvement of intrinsic NTE. In the present work, a significantly enhanced NTE is realized in Cu2P2O7 by applying low pressure. Especially, the volumetric coefficient of thermal expansion (CTE) of Cu2P2O7 reached to -50.0 × 10-6 K-1 (150-325K) under 0.25 GPa, which is increased by 47.5% compared to its NTE in a similar temperature range under atmosphere pressure. This character enables a more effective manifestation of the thermal compensation role of Cu2P2O7 in composites. The enhanced NTE mechanisms are analyzed by high pressure synchrotron X-ray diffraction, neutron diffraction at variable temperature and pressure, as well as density functional theory (DFT) calculations. The results show that applied pressure accelerates the contraction of the distance between adjacent CuO layers and CuO columns. Meanwhile, the low-frequency phonon contribution to NTE in α-Cu2P2O7 is improved. This work is meaningful for the exploration of methods to enhance NTE and the practical application of NTE materials.