RESUMEN
In this study, a simple one-stage laser-assisted metallization technique based on laser-induced backside wet etching and laser-induced chemical liquid-phase deposition is proposed. It allows for the fabrication of gold micropatterns inside the laser-written trace on a glass substrate. The reduction and deposition of gold inside and outside the laser-ablated channel were confirmed. The presence of Au nanoparticles on the surface of the laser-written micropattern is revealed by atomic force microscopy. The specific resistivity of the gold trace formed by ultrafast light-assisted metal micropatterning on a dielectric glass substrate is estimated as 0.04 ± 0.02 mΩ·cm. The obtained results empower the method of the selective laser-assisted deposition of metals on dielectrics and are of interest for the development of microelectronic components and catalysts, heaters, and sensors for lab-on-a-chip devices.
RESUMEN
Glass is a well-known non-conductive material that has many useful properties, and considerable research has been conducted into making circuits on glass. Many deposition techniques have been studied, and laser-induced chemical liquid phase deposition (LCLD) is a well-known and cost-effective method for rapid prototyping of copper deposition on glass. However, the deposition results from the LCLD method on the surface of glass, which shows an issue in its detachment from the substrates because of the relatively low adhesion between deposited copper and the nontreated glass surface. This problem undermines the usability of deposited glass in industrial applications. In this study, the laser-induced backside wet etching (LIBWE) method was performed as a preceding process to fabricate microchannels, which were filled with copper by LCLD. Additional durable copper wire was produced as a result of the enhanced adhesion between the glass and the deposited copper. The adhesion was enhanced by a rough surface and metal layer, which are characteristics of LIBWE machining. Furthermore, the proposed method is expected to broaden the use of deposited glass in industrial applications, such as in stacked or covered multilayer structures with built-in copper wires, because the inserted copper can be physically protected by the microstructures.