RESUMEN

The development of high-performance thermally conductive interface materials is the key to unlocking the serious bottleneck of modern microelectronic technology through enhanced heat dispersion. Existing methods that utilize silicone composites rely either on loading large doses of randomly distributed thermal conductive fillers or on filling prealigned thermal conductive scaffolds with liquid silicone precursors. Both approaches suffer from several limitations in terms of physical traits and processability. We describe an alternative approach in which malleable silicone matrices, based on the dynamic cyclic disulfide nature cross-linker (α-lipoic acid), are readily prepared using ring-opening polymerization. The mechanical properties of the resultant dynamic silicone matrix are readily tunable. Stress-dependent depolymerization of the disulfide network demonstrates the ability to reprocess the silicone elastomer matrix, which allows for the fabrication of highly efficient thermal conductive composites with a 3D interconnecting, thermally conductive network (3D-graphite/MxBy composites) via in situ methods. Applications of the composites as thermal dispersion interface materials are demonstrated by LEDs and CPUs, suggesting great potential in advanced electronics.