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1.
Sensors (Basel) ; 22(19)2022 Sep 23.
Artículo en Inglés | MEDLINE | ID: mdl-36236315

RESUMEN

This paper presents an on-chip fully integrated analog front-end (AFE) with a non-coherent digital binary phase-shift keying (DBPSK) demodulator suitable for short-range magnetic field wireless communication applications. The proposed non-coherent DBPSK demodulator is designed based on using comparators to digitize the received differential analog BPSK signal. The DBPSK demodulator does not need any phase-lock loop (PLL) to detect the data and recover the clock. Moreover, the proposed demodulator provides the detected data and the recovered clock simultaneously. Even though previous studies have offered the basic structure of the AFEs, this work tries to amplify and generate the required differential BPSK signal without missing data and clock throughout the AFE, while a low voltage level signal is received at the input of the AFE. A DC-offset cancellation (DCOC), a cascaded variable gain amplifier (VGA), and a single-to-differential (STOD) converter are employed to construct the implemented AFE. The simulation results indicate that the AFE provides a dynamic range of 0 dB to 40 dB power gain with 2 dB resolution. Measurement results show the minimum detectable voltage at the input of AFE is obtained at 20 mV peak-to-peak. The AFE and the proposed DBSPK demodulator are analyzed and fabricated in a 130 nm Bipolar-CMOS-DMOS (BCD) technology to recover the maximum data rate of 32 kbps where the carrier frequency is 128 kHz. The implemented DCOC, cascaded VGA, STOD, and the demodulator occupy 0.15 mm2, 0.063 mm2, 0.045 mm2, and 0.03 mm2 of area, respectively. The AFE and the demodulator consume 2.9 mA and 0.15 mA of current from an external 5 V power supply, respectively.

2.
Sensors (Basel) ; 22(11)2022 May 26.
Artículo en Inglés | MEDLINE | ID: mdl-35684660

RESUMEN

This paper presents a multi-gain radio frequency (RF) front-end low noise amplifier (LNA) utilizing a multi-core based on the source degeneration topology. The LNA can cover a wide range of input and output frequency matching by using a receiver (RX) switch at the input and a capacitor bank at the output of the LNA. In the proposed architecture here, to avoid the saturation of RX chain, 12 gain steps including positive, 0 dB, and negative power gains are controlled by a mobile industry processor interface (MIPI). The multi-core architecture offers the ability to control the power consumption over different gain steps. In order to avoid the phase discontinuity, the negative gain steps are provided using an active amplification and T-type attenuation path that keeps the phase discontinuity below ±5 degrees between two adjacent power gain steps. Using the multi-core structure, the power consumption is optimized in different power gains. The structure is enhanced with the adaptive variable cores and reactance parameters to maintain different power consumption for different gain steps and remain the output matching in an acceptable operating range. Furthermore, auxiliary linearization circuitries are added to improve the input third intercept point (IIP3) performance of the LNA. The chip is fabricated in 65 nm complementary metal-oxide semiconductor (CMOS) silicon on insulator (SOI) process and the die area is 0.308 mm2. The proposed architecture achieves the IIP3 performance of -10.2 dBm and 8.6 dBm in the highest and lowest power gains, which are 20.5 dB and -11 dB, respectively. It offers the noise figure (NF) performance of 1.15 dB in the highest power gain while it reaches 14 dB when the power gain is -11 dB. The LNA consumes 16.8 mA and 1.33 mA current from a 1 V power supply that is provided by an on-chip low-dropout (LDO) when it operates at the highest and lowest gains, respectively.

3.
Sensors (Basel) ; 22(2)2022 Jan 10.
Artículo en Inglés | MEDLINE | ID: mdl-35062467

RESUMEN

This paper presents a fast-switching Transmit/Receive (T/R) Single-Pole-Double-Throw (SPDT) Radio Frequency (RF) switch. Thorough analyses have been conducted to choose the optimum number of stacks, transistor sizes, gate and body voltages, to satisfy the required specifications. This switch applies six stacks of series and shunt transistors as big as 3.9 mm/160 nm and 0.75 mm/160 nm, respectively. A negative charge pump and a voltage booster generate the negative and boosted control voltages to improve the harmonics and to keep Inter-Modulation Distortion (IMD) performance of the switch over 100 dBc. A Low Drop-Out (LDO) regulator limits the boosted voltage in Absolute Maximum Rating (AMR) conditions and improves the switch performance for Process, Voltage and Temperature (PVT) variations. To reduce the size, a dense custom-made capacitor consisting of different types of capacitors has been presented where they have been placed over each other in layout considering the Design Rule Checks (DRC) and applied in negative charge pump, voltage booster and LDO. This switch has been fabricated and tested in a 90 nm Silicon-on-Insulator (SOI) process. The second and third IMD for all specified blockers remain over 100 dBc and the switching time as fast as 150 ns has been achieved. The Insertion Loss (IL) and isolation at 2.7 GHz are -0.17 dB and -33 dB, respectively. This design consumes 145 uA from supply voltage range of 1.65 V to 1.95 V and occupies 440 × 472 µm2 of die area.

4.
Sensors (Basel) ; 21(24)2021 Dec 14.
Artículo en Inglés | MEDLINE | ID: mdl-34960433

RESUMEN

This paper presents and discusses a Low-Band (LB) Low Noise Amplifier (LNA) design for a diversity receive module where the application is for multi-mode cellular handsets. The LB LNA covers the frequency range between 617 MHz to 960 MHz in 5 different frequency bands and a 5 Pole Single Throw (5PST) switch selects the different frequency bands where two of them are for the main and three for the auxiliary bands. The presented structure covers the gain modes from -12 to 18 dB with 6 dB gain steps where each gain mode has a different current consumption. In order to achieve the Noise Figure (NF) specifications in high gain modes, we have adopted a cascode Common-Source (CS) with inductive source degeneration structure for this design. To achieve the S11 parameters and current consumption specifications, the core and cascode transistors for high gain modes (18 dB, 12 dB, and 6 dB) and low gain modes (0 dB, -6 dB, and -12 dB) have been separated. Nevertheless, to keep the area low and keep the phase discontinuity within ±10∘, we have shared the degeneration and load inductors between two cores. To compensate the performance for Process, Voltage, and Temperature (PVT) variations, the structure applies a Low Drop-Out (LDO) regulator and a corner case voltage compensator. The design has been proceeded in a 65-nm RSB process design kit and the supply voltage is 1 V. For 18 dB and -12 dB gain modes as two examples, the NF, current consumption, and Input Third Order Intercept Point (IIP3) values are 1.2 dB and 16 dB, 10.8 mA and 1.2 mA, and -6 dBm and 8 dBm, respectively.


Asunto(s)
Amplificadores Electrónicos
5.
Sensors (Basel) ; 21(19)2021 Sep 23.
Artículo en Inglés | MEDLINE | ID: mdl-34640682

RESUMEN

This paper presents an analog front-end for fine-dust detection systems with a 77-dB-wide dynamic range and a dual-mode ultra-low noise TIA with 142-dBΩ towards the maximum gain. The required high sensitivity of the analog signal conditioning path dictates having a high sensitivity at the front-end while the Input-Referred Noise (IRN) is kept low. Therefore, a TIA with a high sensitivity to detected current bio-signals is provided by a photodiode module. The analog front end is formed by the TIA, a DC-Offset Cancellation (DCOC) circuit, a Single-to-Differential Amplifier (SDA), and two Programmable Gain Amplifiers (PGAs). Gain adjustment is implemented by a coarse-gain-step using selective loads with four different gain values and fine-gain steps by 42 dB dynamic range during 16 fine steps. The settling time of the TIA is compensated using a capacitive compensation which is applied for the last stage. An off-state circuitry is proposed to avoid any off-current leakage. This TIA is designed in a 0.18 µm standard CMOS technology. Post-layout simulations show a high gain operation with a 67 dB dynamic range, input-referred noise, less than 600 fA/√Hz in low frequencies, and less than 27 fA/√Hz at 20 kHz, a minimum detectable current signal of 4 pA, and a 2.71 mW power consumption. After measuring the full path of the analog signal conditioning path, the experimental results of the fabricated chip show a maximum gain of 142 dB for the TIA. The Single-to-Differential Amplifier delivers a differential waveform with a unity gain. The PGA1 and PGA2 show a maximum gain of 6.7 dB and 6.3 dB, respectively. The full-path analog front-end shows a wide dynamic range of up to 77 dB in the measurement results.

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