RESUMEN
Low-cost approaches for mass production of III-V-based photovoltaics are highly desired today. For the first time, this work presents industrially relevant mask and plate for front metallization of III-V-based solar cells replacing expensive photolithography. Metal contacts are fabricated by nickel (Ni) electroplating directly onto the solar cell's front using a precisely structured mask. Inkjet printing offers low-cost and high-precision processing for application of an appropriate plating resist. It covers the solar cell's front side with narrow openings for subsequent electroplating. The width of the resulting Ni contacts is as low as (10.5 ± 0.8) µm with sharp edges and homogenous shape. The 4 cm2-sized champion III-V-on-silicon triple-junction solar cell with mask and plate front metallization reaches a certified conversion efficiency η of (31.6 ± 1.1) % (AM1.5 g spectrum). It performs just as well as the reference sample with photolithography-structured evaporated front contacts, which reaches η = (31.4 ± 1.1) %.
RESUMEN
Within this work, we demonstrate that an easy soldering process in combination with wet chemical coating is suitable to realize a strong and reliable solder interconnection of Al substrates, even at short soldering times <5 s in ambient air. The microstructure of solder joints on wet chemically treated aluminum foils is investigated. A single and double zincate pre-treatment are compared to activate the Al surface, followed by electroless Ni plating. The quality of the solderable Ni surface is characterized by contact angle measurements, yielding good wettability (<60°), which is also achieved after isothermally heating (250 °C) the Ni-coated Al foils for 100 min. The microstructure of the Sn62Pb36Ag2 solder joints is investigated by SEM and EDX of cross sections, directly after soldering as well as after isothermal aging at 85 °C. Under the used soldering conditions, with a soldering temperature at about 280 °C, diffusion zones <500 nm were identified. Nonetheless, high peel forces after soldering >5 N mm-1 show stable values under aging conditions of 85 °C for 1000 hours. This could be correlated to a mixed fracture pattern, promoting the high adhesion due to the absence of a dominant failure mechanism.