RESUMEN
The technological properties of composite materials (thermal, strength, rheology, electrical and morphology) are very important parameters for high-performance applications. In this study, we aimed to improve the properties of PVA by using carbon materials obtained by the pyrolysis of waste tires, with the aim of recycling them instead of disposing of them. For this purpose, PVA biocomposite films containing carbonized waste rubber at different rates were prepared. The thermal properties of the prepared biocomposite films were examined via thermal gravimetric analysis (TGA) and differential scanning calorimetry (DSC) methods. While rheological measurements were carried out with a rheometer, bulk conductivities were measured with a pico-ammeter. In addition, the morphology of biocomposite films was determined via field emission scanning electron microscopy. The nanomechanical properties of biocomposite film was investigated via XPM analyses. According to the rheological measurements and nanoindentation hardness results, it is understood that as the amount of carbonized waste rubber increases, flexibility decreases and harder and brittle structures are observed in biocomposite films. The electrical measurement results showed that electrical conductivity increased as the amount of carbonized waste rubber increased. When all the results obtained were evaluated, it could be concluded that biocomposite films obtained by increasing the electrical conductivity and hardness of PVA can be used in the electronics industry.
RESUMEN
Poly(lactic) acid nanocomposites filled with graphene nanoplatelets (GNPs) and multiwall carbon nanotubes (MWCNTs) are studied, varying the filler size, shape, and content within 1.5-12 wt.%. The effects of the intrinsic characteristics of nanofillers and structural organization of nanocomposites on mechanical, electrical, thermal, and electromagnetic properties enhancement are investigated. Three essential rheological parameters are identified, which determine rheology-structure-property relations in nanocomposites: the degree of dispersion, percolation threshold, and interfacial interactions. Above the percolation threshold, depending on the degree of dispersion, three structural organizations are observed in nanocomposites: homogeneous network (MWCNTs), segregated network (MWCNTs), and aggregated structure (GNPs). The rheological and structural parameters depend strongly on the type, size, shape, specific surface area, and functionalization of the fillers. Consequently, the homogeneous and segregated network structures resulted in a significant enhancement of tensile mechanical properties and a very low electrical percolation threshold, in contrast to the aggregated structure. The high filler density in the polymer and the low number of graphite walls in MWCNTs are found to be determinant for the remarkable shielding efficiency (close to 100%) of nanocomposites. Moreover, the 2D shaped GNPs predominantly enhance the thermal conductivity compared to the 1D shaped MWCNTs. The proposed essential structural parameters may be successfully used for the design of polymer nanocomposites with enhanced multifunctional properties for 3D printing applications.
RESUMEN
: In this study, the effects of three processing stages: filament extrusion, 3D printing (FDM), and hot-pressing are investigated on electrical conductivity and tensile mechanical properties of poly(lactic) acid (PLA) composites filled with 6 wt.% of multiwall carbon nanotubes(MWCNTs), graphene nanoplatelets (GNPs), and combined fillers. The filaments show several decades' higher electrical conductivity and 50-150% higher values of tensile characteristics, compared to the 3D printed and the hot-pressed samples due to the preferential orientation of nanoparticles during filament extrusion. Similar tensile properties and slightly higher electrical conductivity are found for the hot-pressed compared to the 3D printed samples, due to the reduction of interparticle distances, and consequently, the reduced tunneling resistances in the percolated network by hot pressing. Three structural types are observed in nanocomposite filaments depending on the distribution and interactions of fillers, such as segregated network, homogeneous network, and aggregated structure. The type of structural organization of MWCNTs, GNPs, and combined fillers in the matrix polymer is found determinant for the electrical and tensile properties. The crystallinity of the 3D printed samples is higher compared to the filament and hot-pressed samples, but this structural feature has a slight effect on the electrical and tensile properties. The results help in understanding the influence of processing on the properties of the final products based on PLA composites.
RESUMEN
Electromagnetic and thermal properties of a non-conventional polymer nanocomposite based on thermoplastic Polylactic acid (PLA, Ingeo™) filled, in different weight percentage, with multi-walled carbon nanotubes (MWCNTs), graphene nanoplatelets (GNPs), as well as a mixture of both fillers (MWCNTs/GNPs), are analyzed. The combination of notable electrical, thermal, and electromagnetic (EM) properties of the carbon fillers, in concentrations above the percolation threshold, together with the good processability of the PLA matrix gives rise to innovative filaments for 3D printing. In particular, the shielding efficiency (SE) in the frequency range 26-37 GHz of samples increases from 0.20 dB of unfilled PLA up to 13.4 dB for composites containing MWCNTs and GNPs, corresponding to 4% and 95% of SE, respectively. The thermal conductivity of the PLA loaded with 12 wt % of GNPs is 263% higher than that of the unfilled polymer, whereas an improvement of about 99% and 190% is detected for the PLA matrix loaded with MWCNTs and both fillers, respectively. The EM and thermal characterization is combined with a morphological investigation allowing us to correlate the dispersion states of the fillers within the polymer matrix with the observed EM and thermal properties. The EM and thermal characteristics exhibited by the nanocomposites make them suitable for packaging applications of electronic devices with electromagnetic interference (EMI) shielding and thermal dissipation features.