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1.
Discov Nano ; 18(1): 86, 2023 Jun 16.
Artículo en Inglés | MEDLINE | ID: mdl-37382743

RESUMEN

Group III-V semiconductor multi-junction solar cells are widely used in concentrated-sun and space photovoltaic applications due to their unsurpassed power conversion efficiency and radiation hardness. To further increase the efficiency, new device architectures rely on better bandgap combinations over the mature GaInP/InGaAs/Ge technology, with Ge preferably replaced by a 1.0 eV subcell. Herein, we present a thin-film triple-junction solar cell AlGaAs/GaAs/GaAsBi with 1.0 eV dilute bismide. A compositionally step-graded InGaAs buffer layer is used to integrate high crystalline quality GaAsBi absorber. The solar cells, grown by molecular-beam epitaxy, achieve 19.1% efficiency at AM1.5G spectrum, 2.51 V open-circuit voltage, and 9.86 mA/cm2 short-circuit current density. Device analysis identifies several routes to significantly improve the performance of the GaAsBi subcell and of the overall solar cell. This study is the first to report on multi-junctions incorporating GaAsBi and is an addition to the research on the use of bismuth-containing III-V alloys in photonic device applications.

2.
Nanoscale Res Lett ; 15(1): 121, 2020 May 25.
Artículo en Inglés | MEDLINE | ID: mdl-32451638

RESUMEN

The distribution of alloyed atoms in semiconductors often deviates from a random distribution which can have significant effects on the properties of the materials. In this study, scanning transmission electron microscopy techniques are employed to analyze the distribution of Bi in several distinctly MBE grown GaAs1-xBix alloys. Statistical quantification of atomic-resolution HAADF images, as well as numerical simulations, are employed to interpret the contrast from Bi-containing columns at atomically abrupt (001) GaAs-GaAsBi interface and the onset of CuPt-type ordering. Using monochromated EELS mapping, bulk plasmon energy red-shifts are examined in a sample exhibiting phase-separated domains. This suggests a simple method to investigate local GaAsBi unit-cell volume expansions and to complement standard X-ray-based lattice-strain measurements. Also, a single-variant CuPt-ordered GaAsBi sample grown on an offcut substrate is characterized with atomic scale compositional EDX mappings, and the order parameter is estimated. Finally, a GaAsBi alloy with a vertical Bi composition modulation is synthesized using a low substrate rotation rate. Atomically, resolved EDX and HAADF imaging shows that the usual CuPt-type ordering is further modulated along the [001] growth axis with a period of three lattice constants. These distinct GaAsBi samples exemplify the variety of Bi distributions that can be achieved in this alloy, shedding light on the incorporation mechanisms of Bi atoms and ways to further develop Bi-containing III-V semiconductors.

3.
Nanotechnology ; 31(2): 025602, 2020 Jan 10.
Artículo en Inglés | MEDLINE | ID: mdl-31550684

RESUMEN

Fabrication of practical devices based on the transient metal dichalcogenides (TMDs) can be successively extended to various areas of the applications if the large area growth technology can be intentionally controlled and the characteristics of the layers can be easily predicted. In present work we presented the principles of the technology control based on the single key variable that can be directly related to the sequence of the technological processes. The atomically thin MoS2 layers were used as a model material and the layers were obtained by the CVD synthesis of the molybdenum precursor. Our thorough study demonstrated that the method allowed to deliberately choose the number of the MoS2 two-dimensional (2D)-layers between 1 and 10 by simply choosing the precursor deposition time. The optical properties of the layers were characterised by the optical transitions that corresponded to the known band structure of the MoS2 layers. Fused calibration diagram was proposed as the practical tool for the technology control and it was proved to be highly successive in relating the 2D-properties of the films with the initial stage of the fabrication technology. The method can be adapted to the wafer size TMDs growth on the diverse substrates.

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