RESUMEN
In this work, we demonstrate the high efficiency of optical emission spectroscopy to estimate the etching profile of silicon structures in SF6/C4F8/O2 plasma. The etching profile is evaluated as a ratio of the emission intensity of the oxygen line (778.1 nm) to the fluorine lines (685.8 nm and 703.9 nm). It was found that for the creation of directional structures with line sizes from 13 to 100 µm and aspect ratio from ≈ 0.15 to ≈ 5 the optimal intensities ratio is in the range of 2-6, and for structures from 400 to 4000 µm with aspect ratio from ≈ 0.03 to ≈ 0.37 it is in the range 1.5-2. Moreover, the influence of the process parameters on the etching rate of silicon, the etching rate of aluminum, the inclination angle of the profile wall of the etched window, the selectivity of silicon etching with respect to aluminum, and the influence on the overetching (Bowing effect) of the structure was investigated.