RESUMEN
A four-stage unidirectional ring free-space optical interconnect system was designed, analyzed, implemented, and characterized. The optical system was used within a complementary metal-oxide semiconductor-self-electro-optic-effect-device-based optical backplane demonstrator that was designed to fit into a standard VME chassis. This optical interconnect was a hybrid microlens-macrolens system, in which the microlens relays were arranged in a maximum lens-to-waist configuration to route the optical beams from the optical power supply to the transceiver arrays, while the macrolens optical relays were arranged in a telecentric configuration to route optical signal beams from stage to stage. The following aspects of the optical system design are discussed: the optical parameters for the hybrid optical system, the image mapping of the two-dimensional array of optical beams from stage to stage, the alignment tolerance of the hybrid relay system, and the power budget of the overall optical interconnect. The implementation of the optical system, including the characterization of optical components, subsystem prealignment, and final system assembly, is presented. The two-dimensional array of beams for the stage-to-stage interconnect was adjusted with a rotational error of <0.05 degrees and a lateral offset error of <3.5 mum. The measured throughput is in good agreement with the lower-bound predictions obtained in the theoretical results, with an optical power throughput of -20.2 dB from the fiber input of the optical power supply to the modulator array and -25.5 dB from the fiber input to the detector plane.
RESUMEN
The design of an alignment-detection system that uses off-axis diffractive elements and photodetectors is presented. The system was developed to detect the real-time misalignment of an array of optical beams as they pass through a microchannel relay. The design of this scheme is presented along with experimental results obtained from a prototype detection system.
RESUMEN
We present the design, fabrication, and testing of optomechanics for a free-space optical backplane mounted in a standard 6U VME backplane chassis. The optomechanics implement an optical interconnect consisting of lenslet-to-lenslet, as well as conventional lens-to-lens, links. Mechanical, optical, electrical, thermal, material, and fabrication constraints are studied. Design trade-offs that affect system scalability and ease of assembly are put forward and analyzed. Novel mounting techniques such as a thermal-loaded interference-fitted lens-mounting technique are presented and discussed. Diagnostic tools are developed to quantify the performance of the optomechanics, and experimental results are given and analyzed.
RESUMEN
The design and implementation of a robust, scalable, and modular optical power supply spot-array generator for a modulator-based free-space optical backplane demonstrator is presented. Four arrays of 8 x 4 spots with 6.47-mum radii (at 1/e(2) points) pitched at 125 mum in the vertical direction and 250 mum in the horizontal were required to provide the light for the optical interconnect. Tight system tolerances demanded careful optical design, robust optomechanics, and effective alignment techniques. Issues such as spot-array generation, polarization, power efficiency, and power uniformity are discussed. Characterization results are presented.
RESUMEN
An interferometric alignment technique developed for the assembly of microchannel relay systems is described. The method uses pairs of diffractive lenslets that are arranged to form compact in situ interferometers. The relative transverse, longitudinal, and rotational alignment of the two lenslet arrays can be quantitatively determined from the resulting interference patterns. The theoretical analysis is compared with the experimental performance.
RESUMEN
We describe a system demonstrator based on vertical-cavity surface-emitting lasers, metal-semiconductor-metal detectors, printed circuit board (PCB) level optoelectronic device packaging, a compact bulk optical relay, and novel barrel/PCB optomechanics. The entire system was constructed in a standard VME electrical backplane chassis and was capable of operating at >1.7 Gbit/s of aggregate data capacity. In addition to the component technologies developed, we describe operational testing and characterization of the demonstrator.